Abstract: A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.

Abstract: Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.

Abstract: The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

Abstract: [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: [Problem] The aim of the invention is to provide a method of sealing an electronic element such as an organic EL element using a normal temperature bonding method that enables bonding at low temperature and in which permeation of external gases such as hydrogen or oxygen through the sealed section (dam) formed by the organic material, or the junction interface of the sealed section and a cover substrate is suppressed.

Abstract: [Problem] The aim of the invention is to provide a method of sealing an electronic element such as an organic EL element using a normal temperature bonding method that enables bonding at low temperature and in which permeation of external gases such as hydrogen or oxygen through the sealed section (dam) formed by the organic material, or the junction interface of the sealed section and a cover substrate is suppressed.

Abstract: The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.

Abstract: An anode electrode 10 is composed of a straight elongated cylindrical body, and the outer periphery of the cylindrical body is covered with a dielectric body 12. Further, a cathode portion 20 has a straight semicylindrical shape. A cathode 25 surrounds the anode, and the anode and cathode are disposed parallel to each other in the longitudinal direction. Further, the cathode comprises a cathode wire group 16. Both ends of the cathode wire group are fixed to both ends 20D in the longitudinal direction of the semicylindrical body constituting the cathode portion, so that a plurality of wires become parallel to each other. A reflective surface for reflecting irradiation in a vacuum ultraviolet region is formed on the surface 20S of the cathode portion at the side facing the anode.

Abstract: An anode electrode 10 is composed of a straight elongated cylindrical body, and the outer periphery of the cylindrical body is covered with a dielectric body 12. Further, a cathode portion 20 has a straight semicylindrical shape. A cathode 25 surrounds the anode, and the anode and cathode are disposed parallel to each other in the longitudinal direction. Further, the cathode comprises a cathode wire group 16. Both ends of the cathode wire group are fixed to both ends 20D in the longitudinal direction of the semicylindrical body constituting the cathode portion, so that a plurality of wires become parallel to each other. A reflective surface for reflecting irradiation in a vacuum ultraviolet region is formed on the surface 20S of the cathode portion at the side facing the anode.

Abstract: An anode electrode 10 is composed of a straight elongated cylindrical body, and the outer periphery of the cylindrical body is covered with a dielectric body 12. Further, a cathode portion 20 has a straight semicylindrical shape. A cathode 25 surrounds the anode, and the anode and cathode are disposed parallel to each other in the longitudinal direction. Further, the cathode comprises a cathode wire group 16. Both ends of the cathode wire group are fixed to both ends 20D in the longitudinal direction of the semicylindrical body constituting the cathode portion, so that a plurality of wires become parallel to each other. A reflective surface for reflecting irradiation in a vacuum ultraviolet region is formed on the surface 20S of the cathode portion at the side facing the anode.

Abstract: An anode electrode 10 is composed of a straight elongated cylindrical body, and the outer periphery of the cylindrical body is covered with a dielectric body 12. Further, a cathode portion 20 has a straight semicylindrical shape. A cathode 25 surrounds the anode, and the anode and cathode are disposed parallel to each other in the longitudinal direction. Further, the cathode comprises a cathode wire group 16. Both ends of the cathode wire group are fixed to both ends 20D in the longitudinal direction of the semicylindrical body constituting the cathode portion, so that a plurality of wires become parallel to each other. A reflective surface for reflecting irradiation in a vacuum ultraviolet region is formed on the surface 20S of the cathode portion at the side facing the anode.

Abstract: A connecting device for display panel substrates provided with a first surface table and second surface table for holding the first and second substrates. The connecting device includes a spacer having a thickness substantially equal to a prescribed cell gap, and an operating device for inserting the spacer in between the substrates, or withdrawing the spacer from the same. The connecting device also includes hardening device for hardening sealant material.

Abstract: A method for connecting display panel substrates comprises the following steps. Firstly, a first substrate and a second substrate, whereon sealant material is disposed so as to form a waste region in the inner side region of the edges of the first and second substrates, are aligned in position and held. Thereupon, a spacer having a thickness substantially equal to a prescribed cell gap is inserted into the waste region between the first and second substrates. Next, the cell gap is determined by pressing the first and second substrates. The sealant material is then hardened, whereupon the spacer is withdrawn. In this connecting process for fabricating a display panel, the cell gap can be set readily and precisely to a high degree of accuracy.

Abstract: A method for connecting display panel substrates comprises the following steps. Firstly, a first substrate and a second substrate, whereon sealant material is disposed so as to form a waste region in the inner side region of the edges of the first and second substrates, are aligned in position and held. Thereupon, a spacer having a thickness substantially equal to a prescribed cell gap is inserted into the waste region between the first and second substrates. Next, the cell gap is determined by pressing the first and second substrates. The sealant material is then hardened, whereupon the spacer is withdrawn. In this connecting process for fabricating a display panel, the cell gap can be set readily and precisely to a high degree of accuracy.

Abstract: A liquid crystal sealing device which supplies sealing material for sealing liquid crystal injection holes of sealing areas of a multiplicity of liquid crystal cells simultaneously. This device has a multiplicity of pins which are arranged to match the arrangement of the sealing areas of the multiplicity of liquid crystal cells so that the sealing material can be transferred from a container storing the sealing material to the corresponding sealing area of the liquid crystal cell. This device also has a reciprocating mechanism for reciprocating the multiplicity of pins, as one unit, between a position where the sealing area is to be positioned and the container.

Abstract: A method for connecting display panel substrates comprises the following steps. Firstly, a first substrate and a second substrate, whereon sealant material is disposed so as to form a waste region in the inner side region of the edges of the first and second substrates, are aligned in position and held. Thereupon, a spacer having a thickness substantially equal to a prescribed cell gap is inserted into the waste region between the first and second substrates. Next, the cell gap is determined by pressing the first and second substrates. The sealant material is then hardened, whereupon the spacer is withdrawn. In this connecting process for fabricating a display panel, the cell gap can be set readily and precisely to a high degree of accuracy.