Patents by Inventor Yoshiji Okamoto
Yoshiji Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11202996Abstract: A filtration filter comprises a metallic mesh having a circumferential shape and radially inner and outer portions. The metallic mesh is adapted to filter out a filtration target object contained in a fluid passing through the membrane. First and second frame members hold the outer portion there between so as to create first and second bent sections separated by a transition section extending between the first and second bent sections. The transition section includes at least one streaked projection.Type: GrantFiled: July 15, 2019Date of Patent: December 21, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Kondo, Masaru Banju, Seiichi Matsumoto, Seiji Kamba, Wataru Yamamoto, Yoshiji Okamoto
-
Patent number: 10729993Abstract: A filtration filter comprises a porous film including a central film portion having a plurality of through holes and an outer edge portion adjacent to the central film portion. The porous film portion lies in a flat plane in the absence of a force being applied to the central portion of the central film portion. A frame holds the outer edge portion of the porous film in such a manner that when a force is applied to the central film portion in a first direction, the central film portion moves in the first direction relative to the flat plane and the outer edge portion moves in a second direction, opposite to the first direction, relative to the flat plane. In this way stresses applied to the porous film during a filtering operation are reduced.Type: GrantFiled: April 11, 2017Date of Patent: August 4, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Kondo, Yoshiji Okamoto, Seiji Kamba
-
Publication number: 20190336919Abstract: A filtration filter comprises a metallic mesh having a circumferential shape and radially inner and outer portions. The metallic mesh is adapted to filter out a filtration target object contained in a fluid passing through the membrane. First and second frame members hold the outer portion there between so as to create first and second bent sections separated by a transition section extending between the first and second bent sections. The transition section includes at least one streaked projection.Type: ApplicationFiled: July 15, 2019Publication date: November 7, 2019Inventors: Takashi Kondo, Masaru Banju, Seiichi Matsumoto, Seiji Kamba, Wataru Yamamoto, Yoshiji Okamoto
-
Patent number: 10399042Abstract: A filtration filter comprises a metallic mesh having a circumferential shape and radially inner and outer portions. The metallic mesh is adapted to filter out a filtration target object contained in a fluid passing through the membrane. First and second frame members hold the outer portion there between so as to create first and second bent sections separated by a transition section extending between the first and second bent sections. The transition section includes at least one streaked projection.Type: GrantFiled: March 31, 2017Date of Patent: September 3, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Kondo, Masaru Banju, Seiichi Matsumoto, Seiji Kamba, Wataru Yamamoto, Yoshiji Okamoto
-
Patent number: 10215947Abstract: A fixing instrument includes a first frame member (2) and a second frame member (3) that clamp and fix an aperture array structure. At least any of conditions of Expression 1: A1+C>B1 and Expression 2: A2+C>B2 is satisfied where A1 represents a distance between a first reference surface (22a) and a first inner peripheral fitting face (21a), A2 represents a distance between the first reference surface (22a) and a first outer peripheral fitting face (21b), B1 represents a distance between a second reference surface (32a) and a second inner peripheral fitting face (31a), B2 represents a distance between the second reference surface (32a) and a second outer peripheral fitting face (31b), and C represents a thickness of an outer peripheral section (102) of the aperture array structure.Type: GrantFiled: January 13, 2016Date of Patent: February 26, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yoshiji Okamoto, Seiji Kamba
-
Publication number: 20170216744Abstract: A filtration filter comprises a porous film including a central film portion having a plurality of through holes and an outer edge portion adjacent to the central film portion. The porous film portion lies in a flat plane in the absence of a force being applied to the central portion of the central film portion. A frame holds the outer edge portion of the porous film in such a manner that when a force is applied to the central film portion in a first direction, the central film portion moves in the first direction relative to the flat plane and the outer edge portion moves in a second direction, opposite to the first direction, relative to the flat plane. In this way stresses applied to the porous film during a filtering operation are reduced.Type: ApplicationFiled: April 11, 2017Publication date: August 3, 2017Inventors: Takashi Kondo, Yoshiji Okamoto, Seiji Kamba
-
Publication number: 20170203260Abstract: A filtration filter comprises a metallic mesh having a circumferential shape and radially inner and outer portions. The metallic mesh is adapted to filter out a filtration target object contained in a fluid passing through the membrane. First and second frame members hold the outer portion there between so as to create first and second bent sections separated by a transition section extending between the first and second bent sections. The transition section includes at least one streaked projection.Type: ApplicationFiled: March 31, 2017Publication date: July 20, 2017Inventors: Takashi Kondo, Masaru Banju, Seiichi Matsumoto, Seiji Kamba, Wataru Yamamoto, Yoshiji Okamoto
-
Patent number: 9460853Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.Type: GrantFiled: December 28, 2015Date of Patent: October 4, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshiji Okamoto, Toshihiro Nakai, Shingo Okuyama
-
Patent number: 9460858Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.Type: GrantFiled: January 19, 2016Date of Patent: October 4, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshiji Okamoto, Toshihiro Nakai, Shingo Okuyama
-
Publication number: 20160133385Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.Type: ApplicationFiled: January 19, 2016Publication date: May 12, 2016Inventors: Yoshiji OKAMOTO, Toshihiro NAKAI, Shingo OKUYAMA
-
Publication number: 20160124177Abstract: A fixing instrument includes a first frame member (2) and a second frame member (3) that clamp and fix an aperture array structure. At least any of conditions of Expression 1: A1+C>B1 and Expression 2: A2+C>B2 is satisfied where A1 represents a distance between a first reference surface (22a) and a first inner peripheral fitting face (21a), A2 represents a distance between the first reference surface (22a) and a first outer peripheral fitting face (21b), B1 represents a distance between a second reference surface (32a) and a second inner peripheral fitting face (31a), B2 represents a distance between the second reference surface (32a) and a second outer peripheral fitting face (31b), and C represents a thickness of an outer peripheral section (102) of the aperture array structure.Type: ApplicationFiled: January 13, 2016Publication date: May 5, 2016Inventors: Yoshiji Okamoto, Seiji Kamba
-
Publication number: 20160111212Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.Type: ApplicationFiled: December 28, 2015Publication date: April 21, 2016Inventors: Yoshiji OKAMOTO, Toshihiro NAKAI, Shingo OKUYAMA
-
Patent number: 9269494Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.Type: GrantFiled: April 18, 2013Date of Patent: February 23, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshiji Okamoto, Toshihiro Nakai, Shingo Okuyama
-
Patent number: 9251958Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.Type: GrantFiled: April 18, 2013Date of Patent: February 2, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshiji Okamoto, Toshihiro Nakai, Shingo Okuyama
-
Publication number: 20130279072Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.Type: ApplicationFiled: April 18, 2013Publication date: October 24, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoshiji OKAMOTO, Toshihiro NAKAI, Shingo OKUYAMA
-
Publication number: 20130279071Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.Type: ApplicationFiled: April 18, 2013Publication date: October 24, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Yoshiji OKAMOTO, Toshihiro NAKAI, Shingo OKUYAMA
-
Patent number: 6720714Abstract: A vibrating gyroscope includes a vibrator having a node and a support member having a thin flexible portion and an expanded portion which is connected to the thin flexibly portion and has a larger area than the thin flexible portion. The expanded portion of the support member is fixed to the vibrator at the node.Type: GrantFiled: September 10, 2001Date of Patent: April 13, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuyuki Ishitoko, Katsumi Fujimoto, Yoshiji Okamoto, Hirofumi Tanaka
-
Publication number: 20020047502Abstract: A vibrating gyroscope includes a vibrator having a node and a support member having a thin flexible portion and an expanded portion which is connected to the thin flexibly portion and has a larger area than the thin flexible portion. The expanded portion of the support member is fixed to the vibrator at the node.Type: ApplicationFiled: September 10, 2001Publication date: April 25, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobuyuki Ishitoko, Katsumi Fujimoto, Yoshiji Okamoto, Hirofumi Tanaka
-
Patent number: 6288478Abstract: A vibrating gyroscope includes a vibrator having a node and a support member having a thin flexible portion and an expanded portion which is connected to the thin flexibly portion and has a larger area than the thin flexible portion. The expanded portion of the support member is fixed to the vibrator at the node.Type: GrantFiled: May 28, 1998Date of Patent: September 11, 2001Assignee: Murata Manufacturing Co. Ltd.Inventors: Nobuyuki Ishitoko, Katsumi Fujimoto, Yoshiji Okamoto, Hirofumi Tanaka