Patents by Inventor Yoshikaga Taguchi

Yoshikaga Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10093043
    Abstract: A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: October 9, 2018
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi
  • Patent number: 9643369
    Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: May 9, 2017
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
  • Patent number: 9452572
    Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: September 27, 2016
    Assignee: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Yoshikaga Taguchi, Masayuki Kojima
  • Publication number: 20150343678
    Abstract: A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.
    Type: Application
    Filed: May 5, 2015
    Publication date: December 3, 2015
    Applicant: OMRON Corporation
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi
  • Patent number: 9116264
    Abstract: A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: August 25, 2015
    Assignee: OMRON Corporation
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Yoshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Publication number: 20150021797
    Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.
    Type: Application
    Filed: June 20, 2014
    Publication date: January 22, 2015
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshinori Ito, Yoshikaga Taguchi, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Masayuki Kojima, Yuzuru Fujie, Naoki Hashimoto, Taichi Suzuki
  • Publication number: 20140125917
    Abstract: A method for producing a light guide plate includes forming a light introduction part that introduces light incident through an end face, and forming a light guide plate body that has a thickness less than a maximum thickness of the light introduction part, forming the light guide plate body to be continuously joined to the light introduction part, and forming the light guide plate body so as to cause a light controller to output the incident light to an outside. The light guide plate producing method further includes a conveying step of conveying a resin sheet between a first die and a second die, which are disposed while facing each other, wherein a transfer surface is provided in at least one of surfaces facing each other in the first and second dies.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Applicant: OMRON CORPORATION
    Inventors: Isao Makuta, Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Norikazu Kitamura, Masayuki Shinohara, Kazuhide Hirota, Yoshikaga Taguchi, Masayuki Kojima, Yukihiro Takahashi
  • Publication number: 20140124965
    Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.
    Type: Application
    Filed: February 8, 2013
    Publication date: May 8, 2014
    Inventors: Koichi Takemura, Tomofusa Shibata, Yoshihisa Yamanaka, Kenji Suzuki, Kazutaka Kaneko, Yoshikaga Taguchi, Masayuki Kojima
  • Patent number: 5880653
    Abstract: A manufacturing method for an electromagnetic relay whereby a base block 20 is monolithically molded to terminals 21-24 and connector tabs 62 provided in a lead frame 60. After separating the terminals 21-24 from the lead frame 60 and bending the terminals, a permanent magnet 30 and armature block 40 are assembled into the base block 20. A case 50 is then pressed down over the base block 20 to separate the base block 20 from the connector tabs 62 of the lead frame 60. Electrical inspection and aging treatment can thus be accomplished with the base block 20 connected to the lead frame 60, improving assembly precision and productivity.
    Type: Grant
    Filed: June 10, 1996
    Date of Patent: March 9, 1999
    Assignee: Omron Corporation
    Inventors: Kazuo Yamada, Ryutaro Tsuchiya, Senjiro Ishibashi, Hitoshi Nakano, Mitsuhiro Kawai, Kiyoaki Kuzukawa, Kiyoshi Oka, Hiroyuki Miyaura, Yoshikaga Taguchi, Masayoshi Tani