Abstract: A semiaromatic polyamide resin composition comprising: (A) a polyamide copolymer in which a main constituent component unit is a polyamide formed of a recurring unit of a dicarboxylic acid component unit and a diamine component unit, at least not less than 45 mol % of said dicarboxylic acid component unit being a terephthalic acid component unit, and said diamine component unit comprising a straight-chain alkylenediamine component unit and/or an alkylenediamine component unit having a side-chain alkyl group; (B) an aliphatic polyamide containing, a unit derived from a lactam having 12 carbon atoms, a unit derived from an aminocarboxylic acid having 12 carbon atoms or a unit derived from a dodecanoic diacid and a diamine; and (C) a graft-modified product of a graft-modified ethylene/&agr;-olefin copolymer, a graft-modified product of an aromatic vinyl compound/conjugated diene copolymer, or a graft-modified product of a hydrogenated product of the aromatic vinyl compound/conjugated diene copolymer.

Abstract: A semiaromatic polyamide resin composition of the present invention contains a polyamide (A) in which a dicarboxylic acid component unit comprises a terephthalic acid component unit and a diamine component unit comprises a straight-chain alkylenediamine component unit and an alkylenediamine component unit having a side-chain alkyl group; and a modified ethylene/.alpha.-olefin copolymer (B) obtained by graft-modifying an ethylene/.alpha.-olefin copolymer having particular properties with an unsaturated carboxylic acid or a derivative thereof. A molded article obtained by using this composition exhibits excellent anti-creeping property under high-temperature and high-humidity conditions, and causes the metal mold to be little fouled during the molding operation.

Abstract: The semiaromatic polyamide of the invention comprises 40 to 90% by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50% by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60% by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50% by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25% by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.

Abstract: The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280.degree. C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300.degree. C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.

Abstract: Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.

Abstract: The resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.