Abstract: The quality of an electroluminescent module is improved, and the production costs for it are reduced. In an electroluminescent module comprising a circuit board 1 and an electroluminescent element 2 as bonded to each other, the bonding electrode parts 3a, 3b via which the two 1 and 2 are bonded, are positioned in the facing opposite sides of the electroluminescent element 2, and the two are electrically connected and physically bonded via those parts 3a, 3b to thereby reduce the bonding space. Flexible, insulating resin layers 10a, 10b are provided between the transparent electrode layer 4a and the conductive layer 11 at the connecting electrode part 3a as electrically connected with the transparent electrode layer 4a and between the transparent electrode layer 4a and the back electrode layer 7 at the connecting electrode part 3b as electrically connected with the back electrode layer 7, respectively.