Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.

Abstract: A composition for use as material for electrical or electronic parts, comprising (A) a vinyl polymer having, at a molecular terminal thereof, at least one (meth)acryloyl group per molecule of the polymer, (B) a vinyl monomer having a (meth)acryloyl group and (C) an initiator, wherein the component (B) is comprised in an amount of from 25% by weight or more to 45% by weight or less to the total 100% by weight of the components (A) and (B).

Abstract: The present invention provides an active energy ray-curable composition for an optical material, which is excellent in terms of low viscosity, storage stability, low foaming properties, low-temperature curing, less warpage, depth curability, heat-resistant and light-resistant transparency, rubber properties, crack resistance, resistance to moisture penetration, and designability; a cured product thereof; and a method for producing the same.

Abstract: A composition for use as material for electrical or electronic parts, comprising (A) a vinyl polymer having, at a molecular terminal thereof, at least one (meth)acryloyl group per molecule of the polymer, (B) a vinyl monomer having a (meth)acryloyl group and (C) an initiator, wherein the component (B) is comprised in an amount of from 25% by weight or more to 45% by weight or less to the total 100% by weight of the components (A) and (B).

Abstract: An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield.

Abstract: Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same.

Abstract: An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield.

Abstract: Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same.