Abstract: A control panel assembly adapted for controlling operation of a cooking utensil comprises a control panel, a printed wiring board forming a back surface of the control panel assembly, and circuit elements including a semiconductor chip device arranged on the printed wiring board. Virtually all the bodies of the circuit elements are mounted on a first surface of the printed wiring board. The first surface is opposite to a heating source for the cooking utensil. Virtually all electric connectors for the circuit elements are supported on a second surface of the printed wiring board, the second surface facing the heating source. With such a construction, the second surface including the electric connectors, namely, the back surface of the control panel assembly is substantially flat and non-rugged.