Patents by Inventor Yoshikatsu SHIRAOKAWA

Yoshikatsu SHIRAOKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board
    Patent number: 11136454
    Abstract: The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: October 5, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Keisuke Kushida, Hiroshi Shimizu, Minoru Kakitani, Yoshikatsu Shiraokawa, Tatsunori Kaneko
  • COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE
    Publication number: 20210267052
    Abstract: Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 ?g/dm2; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.
    Type: Application
    Filed: July 17, 2019
    Publication date: August 26, 2021
    Inventors: Yoshikatsu SHIRAOKAWA, Shinichi KAMOSHIDA, Hiroshi KUROKAWA
  • Resin varnish, prepreg, laminate, and printed wiring board
    Patent number: 10940674
    Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 9, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yoshikatsu Shiraokawa, Minoru Kakitani, Hiroshi Shimizu, Keisuke Kushida, Tatsunori Kaneko
  • THERMOSETTING RESIN COMPOSITION AND ITS PRODUCTION METHOD, PREPREG, LAMINATE, AND PRINTED WIRING BOARD
    Publication number: 20200002526
    Abstract: The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.
    Type: Application
    Filed: December 7, 2016
    Publication date: January 2, 2020
    Inventors: Keisuke KUSHIDA, Hiroshi SHIMIZU, Minoru KAKITANI, Yoshikatsu SHIRAOKAWA, Tatsunori KANEKO
  • RESIN VARNISH, PREPREG, LAMINATE, AND PRINTED WIRING BOARD
    Publication number: 20190338093
    Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
    Type: Application
    Filed: December 7, 2016
    Publication date: November 7, 2019
    Inventors: Yoshikatsu SHIRAOKAWA, Minoru KAKITANI, Hiroshi SHIMIZU, Keisuke KUSHIDA, Tatsunori KANEKO