Abstract: The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals.

Abstract: The invention provides a multifunctional VC-TCXO that, as well as promoting miniaturization, selectively configures the functions as needed, and furthermore, is suitable for power savings. In a VC-TCXO provided with a chamber body that accommodates an IC chip and a crystal blank, the IC chip has; basic functions consisting of a first oscillator output function, and a temperature compensating function, and additional functions comprising of a second oscillator output function, an operation/non-operation function of the first oscillator output, and a temperature voltage output function, and basic IC terminals and additional IC terminals for these functions, and basic mounting terminals, and additional mounting terminals.

Abstract: A surface-mount crystal oscillator includes: a crystal blank; an IC chip in which at least an oscillation circuit using the crystal blank is integrated, a plurality of IC terminals are provided on one principal surface, and a plurality of mounting terminals for surface mounting are provided on the other principal surface; and a housing member joined to the one principal surface of the IC chip and formed into a recessed shape. The crystal blank is fixed to crystal connection terminals out of the IC terminals, and is hermetically encapsulated in a space formed by the IC chip and the housing member. At least a power supply terminal, an output terminal and a ground terminal out of the IC terminals are electrically connected to the mounting terminals by a through-electrode provided to penetrate through the IC chip.

Abstract: A surface-mount crystal oscillator includes: a crystal blank; an IC chip in which at least an oscillation circuit using the crystal blank is integrated, a plurality of IC terminals are provided on one principal surface, and a plurality of mounting terminals for surface mounting are provided on the other principal surface; and a housing member joined to the one principal surface of the IC chip and formed into a recessed shape. The crystal blank is fixed to crystal connection terminals out of the IC terminals, and is hermetically encapsulated in a space formed by the IC chip and the housing member. At least a power supply terminal, an output terminal and a ground terminal out of the IC terminals are electrically connected to the mounting terminals by a through-electrode provided to penetrate through the IC chip.

Abstract: A temperature-compensated quartz crystal oscillator includes a substrate having a circuit pattern disposed on a surface thereof and mounting electrodes disposed on a reverse side thereof and electrically connected to the circuit pattern, circuit components mounted on the surface of the substrate and electrically connected to the circuit pattern, and a surface-mounted quartz crystal unit having a hermetically sealed quartz crystal blank, and mounted on the surface of the substrate and electrically connected to the circuit pattern. The crystal unit has a cavity defined in a mounting surface thereof, at least one of the circuit components being housed in the cavity.

Abstract: A temperature-compensated crystal oscillator has a mounting substrate for surface-mounting, a crystal oscillator, a temperature compensating circuit for compensating for frequency vs. temperature characteristics of the crystal oscillator, and a frequency adjusting circuit for adjusting an oscillating frequency of the crystal oscillator. The crystal oscillator comprises at least a crystal blank, an IC chip which is electrically connected to the crystal blank and constitutes an oscillating circuit together with the crystal blank, and a surface-mount housing accommodating the crystal blank and the IC chip. The surface-mount housing is mounted on the mounting substrate. Components constituting the temperature compensating circuit and components constituting the frequency adjusting circuit are directly mounted on the mounting substrate.

Abstract: A temperature-compensated quartz crystal oscillator includes a substrate having a circuit pattern disposed on a surface thereof and mounting electrodes disposed on a reverse side thereof and electrically connected to the circuit pattern, circuit components mounted on the surface of the substrate and electrically connected to the circuit pattern, and a surface-mounted quartz crystal unit having a hermetically sealed quartz crystal blank, and mounted on the surface of the substrate and electrically connected to the circuit pattern. The crystal unit has a cavity defined in a mounting surface thereof, at least one of the circuit components being housed in the cavity.

Abstract: A temperature-compensated crystal oscillator has a mounting substrate for surface-mounting, a crystal oscillator, a temperature compensating circuit for compensating for frequency vs. temperature characteristics of the crystal oscillator, and a frequency adjusting circuit for adjusting an oscillating frequency of the crystal oscillator. The crystal oscillator comprises at least a crystal blank, an IC chip which is electrically connected to the crystal blank and constitutes an oscillating circuit together with the crystal blank, and a surface-mount housing accommodating the crystal blank and the IC chip. The surface-mount housing is mounted on the mounting substrate. Components constituting the temperature compensating circuit and components constituting the frequency adjusting circuit are directly mounted on the mounting substrate.

Abstract: The object of the present invention is to provide a polyethylene resin composition which is improved in anti-blocking and slipping properties, and further in antistatic properties without deteriorating the excellent properties of polyethylene, such as transparency and heat sealability.The inventive polyethylene resin composition comprises(A) polyethylene,(B) a zeolite or an anhydrous amorphous aluminosilicate having the basic particle characteristics of zeolite as prepared by acid-treating zeolite,(C) fatty acid amide having a melting point of not more than 130.degree. C., and(D) an antistatic agent.

Abstract: This invention relates to a process of producing a printed wiring board having first and second electrically conductive circuit layers provided on an insulating laminate. The insulating laminate includes a first insulating layer having metal foils provided on both sides thereof and a second insulating layer which is attached to one of the sides of the first insulating layer so as to place one of the electrically conductive circuit layers between the first and second insulating layers. The first electrically conductive circuit layer is formed in a predetermined pattern by printing and etching one of the metal foils. Then, connecting through-holes are formed in the first insulating layer across the first electrically conductive circuit layer and the remaining metal foil. The second insulating layer is attached onto the first insulating layer so that the first electrically conductive circuit layer is covered with the second insulating layer.