Abstract: An object of the present invention is to provide a resin composition having high electrically insulating properties, high thermally conductive properties, low elasticity, and high solder heat resistance as an electrically insulating layer for a metal-based base material to be used for electronic devices, especially for on-vehicle electronic devices, and having favorable workability during coating a body to be coated as a resin composition for an electrically insulating layer before being cured. The present invention provides a thermosetting resin composition, a cured product, and a resin-attached metal foil, each containing a rubber-like polymer compound (A) having a glass transition temperature (Tg) of ?40° C. or lower and a weight average molecular weight (Mw) in a range of 8,000 to 50,000, an epoxy resin (B), a filler (C), and a phenoxy resin (D).

Abstract: A maintenance system for a semiconductor manufacturing apparatus according to an embodiment includes: a chamber including a first seal portion and a second seal portion; a first separating means configured to separate the first seal portion to introduce air into the chamber; a second separating means configured to separate the second seal portion; an intake device configured to suck a gas in the chamber to remove toxic substances in the gas; and a connecting means configured to connect the intake device to the second seal portion being separated by the second separating means.

Abstract: Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness. In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thixotropic index at 25° C. is adjusted to 0.9 or more and less than 1.0.

Abstract: Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness. In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thermal conductivity of a cured product of the thermosetting resin composition is adjusted to 2.5 W/m·K or more.

Abstract: A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.

Abstract: A white heat-hardening resin composition includes rutile-type titanium oxide and a heat-hardening resin.

Abstract: A white hardening resin composition includes a hardening resin and rutile-type titanium oxide produced by a chlorine method.