Abstract: A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is stuck on the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.

Abstract: An IC card (1) has a base card (2), and an IC module (10) placed in a cavity (3) formed in one surface of the base card (2). The IC module (10) comprises a substrate (11), a contact layer (15) formed on one surface of the substrate (11), an IC chip (12) attached to the other surface of the substrate (11), and a frame (14) attached to the other surface of the substrate (11). A space defined by the frame (14) is filled up with an encapsulating resin (13) so as to encapsulate the IC chip (12). A deflection per unit length of the substrate (11) under a predetermined load is greater than that of the base card (2) under the same load. When a bending force is applied to the IC card (1), a portion around the IC chip (12) is protected by the encapsulating resin (13) and the frame (14), and portion of the substrate (11) other than the portion around the IC chip (12) is distorted greatly to absorb the bending force.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Abstract: An apparatus for controlling operation of a recovery boiler for compensating a predetermined reference temperature of black liquor by a compensation value in accordance with a type of an injecting gun provided in the boiler, a compensation value set by the properties of the black liquor, a compensation value set by the temperature of charbed and a compensation value set by an air flow rate to the boiler representing the magnitude of boiler steam output or load to control the black liquor temperature supplied to the boiler.