Abstract: A solar cell covered with a transparent plate through a predetermined gap includes a flexible power generating layer which photoelectrically converts light incident thereon through the transparent plate, a resin layer covering a light receiving surface of the power generating layer, and an adhesion preventing layer covering the surface of the resin layer and facing the transparent plate through the gap. The adhesion preventing layer is made of an inorganic material and has a surface roughness Sz of 1 nm or more and 500 nm or less. Thus, the outermost surface of the solar cell is constituted by the adhesion preventing layer, so that no tack mark occurs even when partial contact occurs between the solar cell and the transparent plate which face each other through the gap. As a result, it is possible to prevent deterioration in appearance due to the tack mark.

Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet includes insulating layers on one surface of an approximately rectangular substrate, and an electronic component and a plate-like frame member (member) embedded inside the insulating layer, wherein the plate-like frame member satisfying the relationship represented by the following formula (1): ?1<?3 and ?2<?3??(1), is mounted on an unmounted portion of the electronic component on the substrate. In the formula, ?1, ?2 and ?3 respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component, the plate-like frame member, and the substrate, the respective wiring layers or the respective insulating layers.

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): ?1<?3 and ?2<?3 . . . (1), is mounted on an unmounted portion of the electronic component 41 on the substrate 11. In the formula, ?1, ?2 and ?3 respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component 41, the plate-like frame member 51, and the substrate 11, the respective wiring layers or the respective insulating layers.

Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and electronic components 41 and chip-like dummy parts 51 primarily made from the same material as the primary material of the electronic component 41 are embedded into the insulating layer 21. Chip-like dummy parts 51 are disposed in an unmounted portion of the electronic components 41 in, for example, a frame-like arrangement so as to surround the plurality of electronic components (groups) 41.

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): ?1<?3 and ?2<?3 . . . (1), is mounted on an unmounted portion of the electronic component 41 on the substrate 11. In the formula, ?1, ?2 and ?3 respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component 41, the plate-like frame member 51, and the substrate 11, the respective wiring layers or the respective insulating layers.

Abstract: The photosensitive composition of the present invention comprises a photocurable component containing a urethane (meth)acrylate compound (A) having a carboxyl group; a thermosetting resin (C); a photopolymerization initiator (D); and a thermopolymerization catalyst (E); and the above-mentioned photocurable component further contains at least one of (B) a compound having an ethylenically unsaturated group, excluding the component (A), and an epoxy (meth)acrylate compound (F) having a carboxyl group. Therefore, the photosensitive composition is suitable for use as an insulating protective coating film for printed circuit boards. Since the cured film made of the photosensitive composition of the present invention is particularly superior in pliability, curling does not occur even when used for a thin circuit board. Therefore, the cured film is best suited for use in an FPC board.

Abstract: The photosensitive composition of the present invention comprises a photocurable component containing a urethane (meth)acrylate compound (A) having a carboxyl group; a thermosetting resin (C); a photopolymerization initiator (D); and a thermopolymerization catalyst (E); and the above-mentioned photocurable component further contains at least one of (B) a compound having an ethylenically unsaturated group, excluding the component (A), and an epoxy (meth)acrylate compound (F) having a carboxyl group. Therefore, the photosensitive composition is suitable for use as an insulating protective coating film for printed circuit boards. Since the cured film made of the photosensitive composition of the present invention is particularly superior in pliability, curling does not occur even when used for a thin circuit board. Therefore, the cured film is best suited for use in an FPC board.