Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 and a coil 30 of spiral shape constituted by multiple turn units 32 connected in a coil axial direction; wherein each turn unit 32 has, in a cross-sectional view in the width direction of the turn unit 32, a flat side 40 that extends in a second direction substantially perpendicular to the coil axis of the coil 30; and the point of intersection 48 between a figure line 42 corresponding to the longest part in a first direction, and a figure line 44 corresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure line 42 within one-quarter of the figure line away from one end 50 on the side 40 or from the other end 52 opposing the side 40.

Abstract: An electronic component includes: an insulator part (10) of rectangular solid shape; a coil element (32) provided inside the insulator part (10); bottom electrodes (40) provided on a bottom face (14) of the insulator part (10) and electrically connected to the coil element (32); a plating layer (62) provided in a manner overlapping each bottom electrode (40) so that its end (64) on the bottom face (14) is away from the end (42) of the bottom electrode (40); a plating layer (60) which is arranged between the bottom electrode (40) and the plating layer (62) and overlaps the bottom electrode (40), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (62); and an insulation layer (70) provided on the bottom face (14) in a manner covering the end (42) of the bottom electrode (40).

Abstract: An electronic component includes: an insulator part (10) of rectangular solid shape; a coil element (32) provided inside the insulator part (10); bottom electrodes (40) provided on a bottom face (14) of the insulator part (10) and electrically connected to the coil element (32); a plating layer (62) provided in a manner overlapping each bottom electrode (40) so that its end (64) on the bottom face (14) is away from the end (42) of the bottom electrode (40); a plating layer (60) which is arranged between the bottom electrode (40) and the plating layer (62) and overlaps the bottom electrode (40), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (62); and an insulation layer (70) provided on the bottom face (14) in a manner covering the end (42) of the bottom electrode (40).

Abstract: A manufacturing method of a coil component according to one or more embodiments includes a step of forming a conductor pattern on a magnetic sheet from a conductive paste containing conductive particles, organic particles made of an organic material, and a binder resin; a step of laminating a plurality of the magnetic sheets on which the conductor pattern has been formed to form a laminate; a first heating step of heating the laminate at a first temperature that is equal to or higher than a decomposition temperature of the binder resin, equal to or higher than a sintering onset temperature of the conductive particles, and lower than a thermal decomposition temperature of the organic particles; and a second heating step of heating the laminate at a second temperature higher than the thermal decomposition temperature of the organic particles. The conductive paste may include inorganic particles made of an inorganic material.

Abstract: In an exemplary embodiment, a coil component includes: an element body part 10 and a coil 30 of spiral shape constituted by multiple turn units 32 connected in a coil axial direction; wherein each turn unit 32 has, in a cross-sectional view in the width direction of the turn unit 32, a flat side 40 that extends in a second direction substantially perpendicular to the coil axis of the coil 30; and the point of intersection 48 between a figure line 42 corresponding to the longest part in a first direction, and a figure line 44 corresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure line 42 within one-quarter of the figure line away from one end 50 on the side 40 or from the other end 52 opposing the side 40.

Abstract: In an embodiment, an electronic component includes: an insulator part 10 of rectangular solid shape; a coil element 32 provided inside the insulator part 10; bottom electrodes 40 provided on a bottom face 14 of the insulator part 10 and electrically connected to the coil element 32; a plating layer 62 provided in a manner overlapping each bottom electrode 40 so that its end 64 on the bottom face 14 is away from the end 42 of the bottom electrode 40; and a plating layer 60 which is arranged between the bottom electrode 40 and the plating layer 62 and overlaps the bottom electrode 40, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer 62. The electronic component can suppress generation of cracking in the insulator part.

Abstract: In an embodiments, a coil component includes: an element body part 10 and a coil 30 of spiral shape constituted by multiple winding conductors 32 and through hole conductors 34 that interconnect the winding conductors 32; wherein each winding conductor 32 has, in a cross-sectional view in the width direction of the winding conductor 32, a flat side 40 that extends in a second direction substantially perpendicular to the coil axis of the coil 30; and the point of intersection 48 between a figure line 42 corresponding to the longest part in a first direction, and a figure line 44 corresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure line 42 within one-quarter of the figure line away from one end 50 on the side 40 or from the other end 52 opposing the side 40.

Abstract: One object of the present invention is to enable identification of the direction of an electronic component, while suppressing increase in cost. The present invention provides an electronic component comprising: an insulator portion having a plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces), the insulator portion including a plurality of regions having different transmissivities of a light beam entering one of the plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces); an internal conductor portion provided in the insulator portion; and external electrodes provided on the insulator portion and electrically connected to the internal conductor portion.

Abstract: In an embodiments, a coil component includes: an element body part 10 and a coil 30 of spiral shape constituted by multiple winding conductors 32 and through hole conductors 34 that interconnect the winding conductors 32; wherein each winding conductor 32 has, in a cross-sectional view in the width direction of the winding conductor 32, a flat side 40 that extends in a second direction substantially perpendicular to the coil axis of the coil 30; and the point of intersection 48 between a figure line 42 corresponding to the longest part in a first direction, and a figure line 44 corresponding to the longest part in the second direction, with respect to the coil axis, is positioned on the figure line 42 within one-quarter of the figure line away from one end 50 on the side 40 or from the other end 52 opposing the side 40.

Abstract: In an embodiment, an electronic component includes: an insulator part 10 of rectangular solid shape; a coil element 32 provided inside the insulator part 10; bottom electrodes 40 provided on a bottom face 14 of the insulator part 10 and electrically connected to the coil element 32; a plating layer 62 provided in a manner overlapping each bottom electrode 40 so that its end 64 on the bottom face 14 is away from the end 42 of the bottom electrode 40; and a plating layer 60 which is arranged between the bottom electrode 40 and the plating layer 62 and overlaps the bottom electrode 40, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer 62. The electronic component can suppress generation of cracking in the insulator part.

Abstract: One object of the present invention is to enable identification of the direction of an electronic component, while suppressing increase in cost. The present invention provides an electronic component comprising: an insulator portion having a plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces), the insulator portion including a plurality of regions having different transmissivities of a light beam entering one of the plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces); an internal conductor portion provided in the insulator portion; and external electrodes provided on the insulator portion and electrically connected to the internal conductor portion.

Abstract: A group of magnetic sheets are stacked and connected via through-holes, on each of which magnetic sheets a circling pattern having connection parts at its corners and ends is formed to form a spiral coil pattern. Leader patterns each have a leader part formed at a position not overlapping with the circling parts of the coil pattern and connected to an external terminal electrode, as well as two connection parts that continue to the leader part and are formed at positions corresponding to the connection parts of the circling patterns, together with a cutout formed between the two connection parts. Magnetic sheets with the leader patterns are provided at the top and bottom of the laminate forming the coil pattern. The multilayer chip inductor can suppress decrease in core area caused by displacement due to the stacking.

Abstract: A group of magnetic sheets are stacked and connected via through-holes, on each of which magnetic sheets a circling pattern having connection parts at its corners and ends is formed to form a spiral coil pattern. Leader patterns each have a leader part formed at a position not overlapping with the circling parts of the coil pattern and connected to an external terminal electrode, as well as two connection parts that continue to the leader part and are formed at positions corresponding to the connection parts of the circling patterns, together with a cutout formed between the two connection parts. Magnetic sheets with the leader patterns are provided at the top and bottom of the laminate forming the coil pattern.

Abstract: A multilayer inductor having a uniformly improved direct current superposition property and an increased inductance value is disclosed. The multilayer inductor contains a laminate of a plurality of first insulating layers and a plurality of conductive layers, and the conductive layers and through hole conductors are connected to form a helical coil in the laminate. A second insulating layer which has a magnetic permeability lower than those of the first insulating layers is disposed such that it crosses an inner magnetic path of the helical coil, and a margin of the second insulating layer overlaps with the conductive layer in the stacking direction and is in contact with the conductive layer in the overlap portion. The magnetic flux density in the laminate is likely to be highest in the overlap portion, and thus, the highest-density magnetic flux passes through the second insulating layer inevitably, whereby the direct current superposition property can be uniformly improved.