Abstract: A semiconductor process for forming specific pattern features comprising the steps of forming a target layer, a hard mask layer and a plurality of equally spaced-apart core bodies on a substrate, forming spacers on sidewalls of the core bodies, removing the core bodies so that the spacers are spaced-apart on the hard mask layer, using spacers as a mask to pattern the hard mask layer, removing the hard mask bodies outside of a predetermined region, forming photoresists on several outermost hard mask bodies of the predetermined region, and using the photoresists and remaining hard mask bodies as a mask to pattern the target layer.

Abstract: A semiconductor process for forming specific pattern features comprising the steps of forming a target layer, a hard mask layer and a plurality of equally spaced-apart core bodies on a substrate, forming spacers on sidewalls of the core bodies, removing the core bodies so that the spacers are spaced-apart on the hard mask layer, using spacers as a mask to pattern the hard mask layer, removing the hard mask bodies outside of a predetermined region, forming photoresists on several outermost hard mask bodies of the predetermined region, and using the photoresists and remaining hard mask bodies as a mask to pattern the target layer.

Abstract: In the present flash memory a threshold voltage of a memory transistor to which data is written is detected and the detected value is used to set an initial value of a pulse voltage of a write pulse signal, and whenever the write pulse signal is applied, the pulse voltage is increased by a step voltage. The memory transistor's drain current and the threshold voltage's variation can be smaller than when a fixed pulse voltage is applied, as conventional.

Abstract: A memory mat is provided separately from a memory mat that is a normal memory area, and data therein cannot be read from the outside. In a page buffer, information input from the outside is stored. A comparing circuit compares security information stored in memory mat with information stored in page buffer, and the comparison result is output to the outside as a status. Even when unauthorized copying is performed, information in memory mat is not copied. Therefore, an external apparatus can easily determine whether or not the semiconductor memory is an unauthorized copy by referring to the status.

Abstract: In the present flash memory a threshold voltage of a memory transistor to which data is written is detected and the detected value is used to set an initial value of a pulse voltage of a write pulse signal, and whenever the write pulse signal is applied, the pulse voltage is increased by a step voltage. The memory transistor's drain current and the threshold voltage's variation can be smaller than when a fixed pulse voltage is applied, as conventional.

Abstract: A memory mat is provided separately from a memory mat that is a normal memory area, and data therein cannot be read from the outside. In a page buffer, information input from the outside is stored. A comparing circuit compares security information stored in memory mat with information stored in page buffer, and the comparison result is output to the outside as a status. Even when unauthorized copying is performed, information in memory mat is not copied. Therefore, an external apparatus can easily determine whether or not the semiconductor memory is an unauthorized copy by referring to the status.

Abstract: Operations of applying an erase pulse and further performing block program before erasure are executed in steps S2 and S3 before applying the erase pulse on a block by block basis. This narrows the distribution width of the threshold voltage, and reduces the number of the memory transistors to be subjected to over-erase verify so that a total erasing time of data of a flash memory can be reduced.

Abstract: Erasing is performed two times for narrowing a distribution width of threshold voltages of memory cells, and reducing the number of memory transistors to be subjected to over-erase verify. The erase verify voltage for the first erasing is set more strictly than the erase verify voltage for the second erasing. The erase pulses for the second erasing can be reduced in number, and the erasing time can be further reduced.

Abstract: A non-volatile semiconductor memory device includes a bank pointer, in which a signal for designating an operating mode to be performed is generated according to coincidence/non-coincidence of prescribed bits of address signals supplied from an address buffer, and the generated signal is supplied to an internal control circuit. Thus, necessary data can be read out from the non-volatile semiconductor memory device at high speed, so that usability of the device is improved.

Abstract: An external read sense amplifier for reading out a data to an outside and an internal verify sense amplifier for reading out a data for an internal operation are provided, separately from each other, to a plurality of banks. Preferably, an internal verify sense amplifier is provided for each prescribed number of memory blocks. There is provided a nonvolatile semiconductor memory device with a background operation function, having a reduced chip occupancy area.

Abstract: At the time of writing data, a tester outputs a chip enable signal /CE of the L level and selection signals of the L level to simultaneously make semiconductor memory devices active. At the time of reading data, the tester outputs the chip enable signal of the L level to the semiconductor memory devices, and selectively switches the logic level of a selection signal to be outputted to some semiconductor memory devices and that of the selection signal to be outputted to the other semiconductor memory devices to the L level. In such a manner, a number of semiconductor memory devices can be tested without increasing the number of pins of the tester.

Abstract: The semiconductor memory device receives K addresses from first to Kth addresses having at least one bit in common (where K is a natural number; K≧2). Each data block is divided into a plurality of sub data blocks, and a plurality of sense amplifier circuits are provided corresponding to the respective sub data blocks. In each data block, K read data are selected in response to the first address input. Each of the K read data is amplified and output by one of the plurality of sense amplifier circuits sequentially selected in response to each address input.

Abstract: At the time of writing data, a tester outputs a chip enable signal /CE of the L level and selection signals of the L level to simultaneously make semiconductor memory devices active. At the time of reading data, the tester outputs the chip enable signal of the L level to the semiconductor memory devices, and selectively switches the logic level of a selection signal to be outputted to some semiconductor memory devices and that of the selection signal to be outputted to the other semiconductor memory devices to the L level. In such a manner, a number of semiconductor memory devices can be tested without increasing the number of pins of the tester.

Abstract: Erasing is performed two times for narrowing a distribution width of threshold voltages of memory cells, and reducing the number of memory transistors to be subjected to over-erase verify. The erase verify voltage for the first erasing is set more strictly than the erase verify voltage for the second erasing. The erase pulses for the second erasing can be reduced in number, and the erasing time can be further reduced.

Abstract: A memory transistor for a lock bit, holding information on whether a memory block can be erased/reprogrammed, is provided in the same column as that of a plurality of dummy cells. Since a sub bit line for reading the lock bit is electrically isolated from a sub bit line for dummy cell, accurate lock-bit reading is possible even when the dummy cell is over erased. Thus, a nonvolatile semiconductor memory device advantageous in reliability and operation time can be provided.

Abstract: A voltage generation portion includes a voltage amplifier circuit, receiving a boosted potential VPP generated by a charge pump circuit to output an output potential Vout equal to a standard potential VIN. Output potentials Vout are distributed as voltages for rewriting and erasing on a flash memory via distributor. The output potential Vout can be changed faster than the boosted potential VPP generated by the charge pump circuit does.

Abstract: An external read sense amplifier for reading out a data to an outside and an internal verify sense amplifier for reading out a data for an internal operation are provided, separately from each other, to a plurality of banks. Preferably, an internal verify sense amplifier is provided for each prescribed number of memory blocks. There is provided a nonvolatile semiconductor memory device with a background operation function, having a reduced chip occupancy area.

Abstract: A non-volatile semiconductor memory device includes a bank pointer, in which a signal for designating an operating mode to be performed is generated according to coincidence/non-coincidence of prescribed bits of address signals supplied from an address buffer, and the generated signal is supplied to an internal control circuit. Thus, necessary data can be read out from the non-volatile semiconductor memory device at high speed, so that usability of the device is improved.

Abstract: Operations of applying an erase pulse and further performing block program before erasure are executed in steps S2 and S3 before applying the erase pulse on a block by block basis. This narrows the distribution width of the threshold voltage, and reduces the number of the memory transistors to be subjected to over-erase verify so that a total erasing time of data of a flash memory can be reduced.

Abstract: A memory cell array is divided into a plurality of memory cell blocks each collectively subjected to an erasing operation as a unit. A P well regions for memory cell transistors and an N well region for electrically separating the P well regions are provided. Select transistors are formed in the same P well region as the memory cell transistor connected to the corresponding sub bit line of P well regions.