Abstract: A liquid crystal display comprising the feature that a backlight comprises a cold cathode ray tube disposed on a surface facing a liquid crystal display panel and a chassis for supporting the cold cathode ray tube, and the cold cathode ray tube is set so that a distance from the chassis at an end to which a high voltage is applied becomes larger than a distance from the chassis at an end to which a low voltage is applied.

Abstract: The present invention can prolong a lifetime of a liquid crystal display device by suppressing the increase of a leak current attributed to the deflection of a cold cathode fluorescent lamp toward a lower frame side. An insulating member is arranged right below a cold cathode fluorescent lamp and above a lower frame. A reflecting sheet is arranged above the insulating member. The insulating member is formed in a block shape having a rectangular cross section. A fixed or more amount of distance is ensured between the cold cathode fluorescent lamp and the reflecting sheet thus suppressing the increase of the leak current.

Abstract: A liquid crystal display comprising the feature that a backlight comprises a cold cathode ray tube disposed on a surface facing a liquid crystal display panel and a chassis for supporting the cold cathode ray tube, and the cold cathode ray tube is set so that a distance from the chassis at an end to which a high voltage is applied becomes larger than a distance from the chassis at an end to which a low voltage is applied.

Abstract: In order that popcorning and delamination resulting from moisture vapor in a semiconductor package may be prevented, a vent hole is formed in a die-bonding area of a plastic substrate so as to extend vertically through the substrate. An upper open end of the vent hole is covered with a solder resist film and a semiconductor chip is die-bonded on the solder resist film. In the die-bonding step, the solder resist film prevents an adhesive agent from flowing into the vent hole through the upper open end, so that gas permeability of the vent hole can be ensured. Furthermore, since the solder resist film has gas permeability, moisture vapor in the package is released outside through the vent hole and the solder resist film during a reflow heating.