Abstract: A grain flour includes milled grains of at least one grain selected from the group consisting of barley and oat. In the grain flour, the average grain diameter is in the range of 40-100 ?m. The content of grains having a grain diameter less than 20 ?m is not greater than 20 mass %, the content of grains having a grain diameter in the range of 20-100 ?m is in the range of 20-60 mass %, the content of grains having a grain diameter greater than 100 ?m and not greater than 500 ?m is in the range of 20-60 mass %, and the content of grains having a grain diameter greater than 500 ?m is not greater than 5%. An application food using the grain flour is produced from a starting material which contains at least 5% of the grain flour. A method for producing the grain flour is also provided.

Abstract: According to one embodiment, a radar device includes a radio module, a pulse compressor, a Doppler filter processor, a signal processor, an integration processor, an estimation module and a target detector. The radio module receives a plurality of received pulses corresponding to transmission pulses transmitted from a transmitter. The integration processor generates third data by integrating first data generated at the signal processor with second data generated based on first data obtained by a previous scan. The estimation module estimates a position at a time of a next scan based on the third data to generate second data. The target detector detects a target based on the third data.

Abstract: A diagnostic marker is composed of particles that have a diameter of from 1 nm to 100 ?m, the particles possessing on their surfaces a site that has a high specific bonding ability to a specific antigen residing on the mucosa of digestive cancers and a site that has a low bonding ability to the mucosa of digestive organs, and further incorporating an identification material.

Abstract: A grain flour includes milled grains of at least one grain selected from the group consisting of barley and oat. In the grain flour, the average grain diameter is in the range of 40-100 ?m. The content of grains having a grain diameter less than 20 ?m is not greater than 20 mass %, the content of grains having a grain diameter in the range of 20-100 ?m is in the range of 20-60 mass %, the content of grains having a grain diameter greater than 100 ?m and not greater than 500 ?m is in the range of 20-60 mass %, and the content of grains having a grain diameter greater than 500 ?m is not greater than 5%. An application food using the grain flour is produced from a starting material which contains at least 5% of the grain flour. A method for producing the grain flour is also provided.

Abstract: According to one embodiment, a radar equipment includes a signal processor, a first and second estimation module and an integration module. The signal processor generates first data based on range bin data. The first estimation module estimates a present position of a target based on second data, and shifts the second data to the estimated position to generate third data. The second estimation module estimates the present position based on first data of an nth previous scan, and shifts the first data of the nth previous scan to the estimated position to generate fourth data. The integration module adds the third data to, and subtracts the fourth data from first data obtained by the present scan to generate second data.

Abstract: According to one embodiment, a radar equipment includes a radio transmitter, a pulse compressor, a Doppler filter, and an integration processor. The radio transmitter receives pulse signals and digitizes the received pulse signals by oversampling with a frequency higher than that for generation of a pulse compression coefficient to generate digital data. The pulse compressor performs pulse compression on the digital data using the pulse compression coefficient to generate range bin data for each of the pulse signals. The Doppler filter processor performs Doppler filter processing on the range bin data. The integration processor integrates the range bin data subjected to the Doppler filter processing for each range bin.

Abstract: In an adaptive array antenna, an array antenna receives a signal containing a reflected target signal of a radar pulse, a correlation filter circuit suppresses a component correlating with a target signal in the received signal by applying a correlation filter to the received signal, a weight calculation circuit calculates an adaptive weight from data processed with application of the correlation filter, and a beam synthesizing circuit creates output data by performing weight control on the received signal by using the adaptive weight.

Abstract: According to one embodiment, a radar device includes a radio module, a pulse compressor, a Doppler filter processor, a signal processor, an integration processor, an estimation module and a target detector. The radio module receives a plurality of received pulses corresponding to transmission pulses transmitted from a transmitter. The integration processor generates third data by integrating first data generated at the signal processor with second data generated based on first data obtained by a previous scan. The estimation module estimates a position at a time of a next scan based on the third data to generate second data. The target detector detects a target based on the third data.

Abstract: A curable composition for an optical material including a specific silicon-containing polymer (A), a specific epoxy resin (B) and an energy ray-sensitive cationic polymerization initiator (C) as essential components.

Abstract: A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra-Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y=C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.

Abstract: A curable composition which comprises at least one of the following (A), (B), and (C) and further contains (D) (provided that when (C) is not contained, both (A) and (B) are in the composition. (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A? and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A?, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst.

Abstract: The outer surface of a wide-gap semiconductor device is coated with a synthetic polymer compound containing one or more silicon-containing polymer having a bridged structure formed by a siloxane (Si—O—Si bond structure). The synthetic polymer compound may include, for example, a silicon-containing polymer which has one or more reactive groups (A?) selected from Si—R1, Si—O—R2 and Si—R3—OCOC(R4)?CH2, has a bridged structure formed by an Si—O—Si bond in one or more locations, and contains components having weight average molecular weights of not more than 1000 in an amount of 20% or less by weight.

Abstract: A silicon-containing compound of formula (1), and a curing composition containing a silicon-containing compound of formula (1) wherein Z is hydrogen, a silicon-containing compound of formula (1) wherein Z is C2-C4 alkenyl or alkynyl and a hydrosilylation catalyst. The composition has excellent handling and curing properties and provides a cured product with excellent heat resistance and flexibility. In formula (1), Ra—Rg=C1-C12 saturated aliphatic hydrocarbon group or C6-C12 aromatic hydrocarbon group. Re and Rf do not simultaneously represent C1-C12 saturated aliphatic hydrocarbon group; Y?C2-C4 alkylene; Z=hydrogen or C2-C4 alkenyl or alkynyl; K is 2-7; T is 1-7; P is 0-3; and M and N are numbers selected such that N:M=1:1 to 1:100, that all M's and N's total at least 15, and that the mass average molecular weight of the compound of formula (1) is 3,000 to 1,000,000.

Abstract: A received data storage situation is monitored, and a covariance matrix Ri of the i-th range cell is calculated to be temporarily stored. Covariance matrices Ri of the number of training samples are called until the i becomes T from 1, covariance matrices Ri are averaged by adding, and averaged covariance matrix data R[1]rr is temporarily stored. Averaged covariance matrix data R[i?1]rr is called until the i becomes L from 2, Ri and Ri?4 are added to the data R[i?1]rr, Ri+3, and Ri?1 are subtracted from the data R[i?1]rr, the resulting data R[1]rr is temporarily stored, and a series of processing is terminated.

Abstract: A diagnostic marker is composed of particles that have a diameter of from 1 nm to 100 ?m, the particles possessing on their surfaces a site that has a high specific bonding ability to a specific antigen residing on the mucosa of digestive cancers and a site that has a low bonding ability to the mucosa of digestive organs, and further incorporating an identification material.

Abstract: A curable composition for an optical material including a specific silicon-containing polymer (A), a specific epoxy resin (B) and an energy ray-sensitive cationic polymerization initiator (C) as essential components.

Abstract: A ?-glucan-containing fat and oil composition contains ?-glucan of microorganism origin or basidiomycete origin. The ?-glucan-containing fat and oil composition has ?-glucan uniformly dispersed in a food without worsening the texture, taste etc. of the food. The novel microorganism can efficiently produce ?-glucan which has a high activity and favorable qualities as ?-glucan of microorganism origin as described above from less expensive saccharides such as sucrose at a high production speed.

Abstract: The outer surface of a wide-gap semiconductor device is coated with a synthetic polymer compound containing one or more silicon-containing polymer having a bridged structure formed by a siloxane (Si—O—Si bond structure). The synthetic polymer compound may include, for example, a silicon-containing polymer which has one or more reactive groups (A?) selected from Si—R1, Si—O—R2 and Si—R3—OCOC(R4)?CH2, has a bridged structure formed by an Si—O—Si bond in one or more locations, and contains components having weight average molecular weights of not more than 1000 in an amount of 20% or less by weight.

Abstract: The outer surface of a wide-gap semiconductor device is covered with a synthetic polymer compound. The synthetic polymer compound is formed by linking a plurality of third organosilicon polymers through covalent bonding which is formed by addition reaction, and has a three-dimensional steric structure. The third organosilicon polymers are obtained by liking one or more kinds of first organosilicon polymers having a bridge structure formed by siloxane bonds (Si—O—Si bonds) with one or more kinds of second organosilicon polymers having a linear structure formed by siloxane bonds. Insulating ceramic fine particles having high heat conductivity are preferably mixed with the synthetic polymer compound.

Abstract: A high withstand voltage semiconductor chip mounted on a package or a board is covered with a sealing resin, and the resin is cured while a high voltage is applied between at least one of electrode terminals connected from a chip electrode or the chip via wiring of wires or the like and another electrode that necessitates a dielectric withstand voltage between the electrode and the electrode terminal during the curing. The sealing resin is provided by a synthetic high molecular compound structured in a manner that an organic silicon polymer C is constituted by alternately linearly linking an organic silicon polymer A having a crosslinking structure of siloxane with an organic silicon polymer B having a linear link structure of siloxane (Si—O—Si bond) by siloxane bond and the polymers are three-dimensionally linked together by covalent bond.