Abstract: A sorting method of monolithic ceramic capacitors in which high reliable sorting can be efficiently achieved based on measuring an insulating resistance involves first performing a burn-in process, which applies not less than double of the rated voltage at the maximum working temperature to a monolithic ceramic capacitor. Thereafter, a high temperature insulation resistance measuring process, which involves measuring an insulation resistance while applying not less than the rated voltage at a temperature of not less than 70° C. to the monolithic ceramic capacitor, is performed so that monolithic ceramic capacitors having abnormal insulation resistances are eliminated. Preferably, the direction of applied voltage in the burn-in process agrees with the direction of applied voltage in the high temperature insulation resistance measuring process.

Abstract: In the temperature of 70-140 degrees C., the burn-in process of applying a voltage to monolithic ceramic capacitors so that the strength of the electric field applied between the internal electrodes opposing each other may be 7 30 kV/mm is performed. Subsequently, the insulation resistance of the monolithic ceramic capacitor is measured. The monolithic ceramic capacitors are sorted based on the insulation resistance measured during this insulation-resistance measurement process. In this case, it is sufficient to apply the burn-in process for 2-300 seconds.

Abstract: This invention aims to provide a process for producing an oxide-dispersion strengthened platinum material which allows zirconium oxide to be more finely dispersed in a platinum material, and to further improve creep strength in an oxide-dispersion strengthened platinum material.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a u shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: The present invention is aimed at providing a platinum material in which creep strength is elevated by improving a metal grain shape in an oxide-dispersion strengthened platinum material in which zirconium oxide is dispersed, and providing a process for producing the platinum material.

Abstract: A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Abstract: A ceramic electronic component includes a ceramic electronic component body having two end faces opposing each other, side faces connecting the two end faces, and terminal electrodes formed on each end face; and terminal members, each including a metal being soldered to one of the terminal electrodes. Each of the terminal electrodes includes a metal layer formed only on the end face, a conductive resin layer formed on the metal layer, the conductive resin layer including metal powder and resin, and a plating film on the conductive resin layer.

Abstract: A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 &mgr;m.

Abstract: An electronic multilayer ceramic component is disclosed which is less susceptible to having a crack or delamination in a sintered ceramic block and has high thermal shock resistance, high humidity resistance, and high reliability. Dimensional parameters EW, WG, T, and G of the electronic multilayer ceramic component are determined such that the following conditions are satisfied: WG/EW≧0.3; and T/G≦7.0, where EW is the width of inner electrodes, WG is the width of a side gap region between the ends of the inner electrodes and one of side faces of a sintered ceramic block, T is the thickness of a region in which the plurality of inner electrodes are laminated, and G is the thickness of one of the outermost ceramic layers parallel to the plurality of inner electrodes and located outside the region in which the plurality of inner electrodes are laminated.

Abstract: The present invention provides a laminated ceramic capacitor having good temperature characteristics, and suitable for attaining miniaturization, large capacitance and low production cost besides having high reliability in the high temperature load test, wherein a plurality of inner electrodes are formed in a ceramic sintered body comprising a reduction resistant dielectric ceramic in which grains having a core-shell structure and grains having a homogeneous structure are mixed together, and wherein outer electrodes are formed on the outer surfaces of the ceramic sintered body, the area ratio between the total area of the grains having the core-shell structure and the total area of the grains having the homogeneous structure being adjusted within a the range of about 2:8 to 4:6 when a cross section is observed along an arbitrary direction of the ceramic sintered body.

Abstract: The present invention provides a reliable ceramic electronic component in which cracks are hardly generated in the ceramic sintered body when a heat impact is applied or even when a stress caused by bending of a printed circuit board after packaging is applied, wherein inner electrodes are disposed in the ceramic sintered body, and wherein a first and second outer electrodes are formed so as to cover the first and second end faces, the first and second outer electrodes comprising electrode cover members extending to the upper face and lower face, up to both side faces of the ceramic sintered body, and the distance e and the distance Lg satisfying the relation of 1.5×Lg≦e≦3.

Abstract: A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.

Abstract: A projection 23 is formed on a connecting terminal part 22 opposing to a side surface 16 of a ceramic electronic component main body 12 in a terminal member 19 by processing the metal plate which provides this terminal member 19. This projection 23 is made to project toward the side surface 16 of the ceramic electronic component main body 12. The interval more than the predetermined dimension is reliably formed between the connecting terminal part 22 and the side surface 16 of the ceramic electronic component main body 12 by the projection 23. This prevents the solder from reaching even to the ceramic electronic component main body 12.

Abstract: A ceramic electronic part includes at least one chip ceramic electronic part body having terminal electrodes and terminals provided on both sides. Each terminal is composed of a metal plate bent into a U shape. The outer face of a first leg of each bent terminal faces and is attached to a terminal electrode, and a second leg is attached to a substrate. The inner face of the bent terminal is provided with a solder-phobic surface not having affinity for solder, and the outer face of the bent terminal is provided with a solder-philic surface having high affinity for solder.

Abstract: There is provided a highly reliable laminated ceramic electronic part in which delamination or crack can be suppressed from occurring during a sintering process even if a number of lamination of internal electrodes is increased and a thickness of the ceramic layer is reduced and which excels in thermal shock resistance. The laminated ceramic electronic part is constructed so as to satisfy the following requirements of that a thickness of the ceramic layer is 10 .mu.m or less; a number of lamination of the internal electrodes is 200 or more; a ratio of a thickness of the internal electrode to the thickness of the ceramic layer (thickness of internal electrode/thickness of ceramic layer) is 0.10 to 0.40; and a ratio of a volume of the internal electrode to a volume of the ceramic element (volume of internal electrodes/volume of ceramic element) is 0.10 to 0.30.