Abstract: A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.

Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

Abstract: A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.

Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.

Abstract: A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.

Abstract: An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.

Abstract: An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers.

Abstract: An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.

Abstract: An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers.