Patents by Inventor Yoshikazu Tsuya

Yoshikazu Tsuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9178264
    Abstract: A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: November 3, 2015
    Assignee: TDK CORPORATION
    Inventors: Hajime Kuwajima, Toshiyasu Fujiwara, Naoto Ohyama, Yoshikazu Tsuya, Masami Sasaki
  • Patent number: 9107323
    Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: August 11, 2015
    Assignee: TDK Corporation
    Inventors: Shigemitsu Tomaki, Yoshikazu Tsuya, Masamichi Tanaka, Isao Abe
  • Publication number: 20150180112
    Abstract: A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.
    Type: Application
    Filed: March 4, 2015
    Publication date: June 25, 2015
    Applicant: TDK Corporation
    Inventors: Hajime KUWAJIMA, Toshiyasu FUJIWARA, Naoto OHYAMA, Yoshikazu TSUYA, Masami SASAKI
  • Publication number: 20130120950
    Abstract: A bandpass filter module includes a mounting board and a BPF chip mounted on a surface thereof. The BPF chip includes three or more resonators; a first-stage resonator located closest to an input terminal, a final-stage resonator located closest to an output terminal, and a middle-stage resonator connected between the first-stage and the final-stage resonators and located in a chip middle zone. The mounting board includes an area overlapping with the chip middle zone, viewed in plan, defining a ground-free space in which no ground electrode is disposed. The ground-free space is formed at least from the surface of the mounting board to a depth position at which a topmost internal wiring layer is located. The middle-stage resonator is prevented from being coupled to ground electrodes on the mounting board and from a lower Q-value and increased insertion loss.
    Type: Application
    Filed: July 21, 2011
    Publication date: May 16, 2013
    Applicant: TDK Corporation
    Inventors: Shigemitsu Tomaki, Yoshikazu Tsuya, Masamichi Tanaka, Isao Abe
  • Publication number: 20130027273
    Abstract: A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.
    Type: Application
    Filed: July 20, 2012
    Publication date: January 31, 2013
    Applicant: TDK Corporation
    Inventors: Hajime Kuwajima, Toshiyasu Fujiwara, Naoto Ohyama, Yoshikazu Tsuya, Masami Sasaki
  • Patent number: 8120446
    Abstract: An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: February 21, 2012
    Assignee: TDK Corporation
    Inventors: Shigemitsu Tomaki, Noriaki Ootsuka, Yoshikazu Tsuya, Kazushige Shinoda
  • Patent number: 8018305
    Abstract: An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: September 13, 2011
    Assignee: TDK Corporation
    Inventors: Shigemitsu Tomaki, Noriaki Ootsuka, Yoshikazu Tsuya, Kazushige Shinoda
  • Publication number: 20090121813
    Abstract: An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers.
    Type: Application
    Filed: October 20, 2008
    Publication date: May 14, 2009
    Applicant: TDK CORPORATION
    Inventors: Shigemitsu Tomaki, Noriaki Ootsuka, Yoshikazu Tsuya, Kazushige Shinoda
  • Publication number: 20090121807
    Abstract: An electronic component includes a layered substrate including a plurality of dielectric layers stacked, and three resonators provided within the layered substrate. One of the three resonators includes resonator-forming conductor layers of a first type and a second type that each have a short-circuited end and an open-circuited end, relative positions of the short-circuited end and the open-circuited end being reversed between the first and second types. The resonator-forming conductor layers of the first type and the second type are arranged to be adjacent to each other in a direction in which the plurality of dielectric layers are stacked.
    Type: Application
    Filed: October 20, 2008
    Publication date: May 14, 2009
    Applicant: TDK CORPORATION
    Inventors: Shigemitsu Tomaki, Noriaki Ootsuka, Yoshikazu Tsuya, Kazushige Shinoda