Abstract: A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.

Abstract: A probe for current test comprising: a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board; a solder layer formed on at least one side face of said connection portion; and a guide portion formed on the connection portion, penetrating the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face, and when the solder layer is melted, capable of guiding a portion thereof to the other side face.

Abstract: A probe for electrical test comprises an arm region extending in a first direction, and a tip region leading to one side in a second direction intersecting the first direction of the arm region, and has a plate form making a direction interesting the first and second directions a thickness direction. The tip region includes a pedestal portion leading to the arm region and a contact portion leading to the pedestal portion, and the contact portion includes a base portion forming a part of the pedestal portion and a projecting portion leading to the base portion and projecting from the pedestal portion in the second direction. By this, damage to the contact portion is prevented.