Abstract: A synthetic resin packed coil assembly formed by a wound spiral of a number of bundled turns of insulated wire comprises at least one layer enveloping the bundled turns of insulated wire of the wound spiral. This layer is composed of a synthetic resin reinforced by a high strength fibrous material and is formed by first winding the high strength fibrous material around the bundled turns of insulated wire of the wound spiral, subsequently impregnating a solution of the synthetic resin and finally allowing the synthetic resin to harden.

Abstract: The method of the present disclosure includes preparing a coil which is impregnated with resin to form a resin packed coil, in which the resin is still in a liquid phase, immersing the resin packed coil into a wax in the liquid state, hardening the wax adhering around the resin packed coil, hardening the resin which is impregnated in the coil, and removing the wax, thus obtaining a resin packed coil assembly where the resin is hardened and surrounds the coil.

Abstract: Encapsulation method not requiring molds and according to which curing of a thermosetting substance which when hardened provides requisite protection to an electrical or other assembly consisting of one or a plurality of elements is effected while the assembly is surrounded by a substance which remains solid and prevents movement of the thermosetting substance out of contact with the assembly during thermoplastic stages of curing thereof, and melts when the thermosetting substance has hardened, whereby the assembly may be moved out of contact therewith.