Abstract: A wiring substrate includes an insulator and first and second conductors. The insulator has a first top surface, a first side surface, and first and second recesses. The first conductor is positioned on the first top surface and has a first end surface. The second conductor is positioned on the first top surface and has a second end surface. The first recess contacts the first and second end surfaces. The second recess is between the first and second conductors. The first recess extends in a second direction and has a first inner side surface and a first bottom surface. The second recess has a second inner side surface and a second bottom surface. The distance from the first top surface to the first bottom surface in a third direction is smaller than the distance from the first top surface to the second bottom surface in the third direction.

Abstract: The present invention includes a C-type resin clip projecting from an exterior surface on a band tightener in a band-type wire harness mount or from a front surface on a middle portion of a substrate in a substrate-type wire harness mount, and a C-type metal clip having a length shorter than the C-type resin clip. The C-type metal clip is mounted between upper and lower tabs of the C-type resin clip. A pressing projection is provided on opposing interior surfaces of each of the upper and lower tabs of the C-type resin clip, and a press-down tab is provided on the upper and lower tabs of the C-type metal clip. When a bracket is pressed in between the upper and lower tabs of the C-type metal clip, the press-down tabs are lifted by the pressing projections and both the upper and lower surfaces of the bracket are pinched and held.

Abstract: The present invention includes a C-type resin clip projecting from an exterior surface on a band tightener in a band-type wire harness mount or from a front surface on a middle portion of a substrate in a substrate-type wire harness mount, and a C-type metal clip having a length shorter than the C-type resin clip. The C-type metal clip is mounted between upper and lower tabs of the C-type resin clip. A pressing projection is provided on opposing interior surfaces of each of the upper and lower tabs of the C-type resin clip, and a press-down tab is provided on the upper and lower tabs of the C-type metal clip. When a bracket is pressed in between the upper and lower tabs of the C-type metal clip, the press-down tabs are lifted by the pressing projections and both the upper and lower surfaces of the bracket are pinched and held.