Patents by Inventor Yoshiki Ishiai

Yoshiki Ishiai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10562154
    Abstract: Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 ?m to 50 ?m. The average grain size of the boron compound grains is greater than ? and less than or equal to ½ of the average grain size of the diamond abrasive grains.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: February 18, 2020
    Assignee: DISCO CORPORATION
    Inventors: Ryogo Maji, Ryuji Oshima, Yoshiki Ishiai
  • Publication number: 20170057054
    Abstract: Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 ?m to 50 ?m. The average grain size of the boron compound grains is greater than 1/5 and less than or equal to 1/2 of the average grain size of the diamond abrasive grains.
    Type: Application
    Filed: August 18, 2016
    Publication date: March 2, 2017
    Inventors: Ryogo Maji, Ryuji Oshima, Yoshiki Ishiai
  • Publication number: 20160311127
    Abstract: A cutting apparatus for cutting a workpiece includes: a holding unit for holding the workpiece; a cutting unit including a cutting blade for cutting the workpiece held by the holding unit, and a spindle for rotating the cutting blade; a cutting water supplying unit for supplying cutting water to the cutting blade; and a cleaning fluid jetting unit for jetting to the cutting blade a cleaning fluid for removal of matter adhered to the cutting blade.
    Type: Application
    Filed: April 24, 2015
    Publication date: October 27, 2016
    Inventors: Yuya Itatani, Yoshiki Ishiai