Patents by Inventor Yoshiki Manabe

Yoshiki Manabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220324887
    Abstract: An organometallic adduct compound and a method of manufacturing an integrated circuit device, the organometallic adduct compound being represented by General Formula (I):
    Type: Application
    Filed: March 30, 2022
    Publication date: October 13, 2022
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Younsoo KIM, Jaewoon KIM, Kazuki HARANO, Kazuya SAITO, Takanori KOIDE, Yutaro AOKI, Gyuhee PARK, Younjoung CHO, Wakana FUSE, Yoshiki MANABE, Hiroyuki UCHIUZOU, Masayuki KIMURA, Takahiro YOSHII
  • Patent number: 11332486
    Abstract: Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: May 17, 2022
    Assignees: SAMSUNG ELECTRONICS CO., LTD., ADEKA CORPORATION
    Inventors: Gyu-Hee Park, Takanori Koide, Yoshiki Manabe, Masayuki Kimura, Akio Saito, Jaesoon Lim, Younjoung Cho
  • Publication number: 20210388010
    Abstract: An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),
    Type: Application
    Filed: June 14, 2021
    Publication date: December 16, 2021
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Younsoo KIM, Gyuhee PARK, Younjoung CHO, Yutaro AOKI, Wakana FUSE, Kazuki HARANO, Takanori KOIDE, Yoshiki MANABE, Kazuya SAITO, Hiroyuki UCHIUZOU
  • Publication number: 20210380622
    Abstract: Materials for fabricating a thin film that has improved quality and productivity are provided. The materials may include a Group 5 element precursor of formula (1): M1 may be a Group 5 element, each of R1 to R10 independently may be a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or f7onnula (2), R11 may be a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and L1 may be an alkyl group, an alkylamino group, an alkoxy group or an alkylsilyl group, each of which may have 1 to 5 carbon atoms and may be substituted or unsubstituted. Formula (2) may have a structure of Each of Ra to Rc independently may be a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms.
    Type: Application
    Filed: March 29, 2021
    Publication date: December 9, 2021
    Inventors: Seung-Min Ryu, Gyu-Hee Park, Youn Joung Cho, Kazuki Harano, Takanori Koide, Wakana Fuse, Yoshiki Manabe, Yutaro Aoki, Hiroyuki Uchiuzou, Kazuya Saito
  • Publication number: 20210284667
    Abstract: An organometallic adduct compound and a method of manufacturing an integrated circuit (IC) device, the organometallic adduct compound being represented by General formula (I): in General formula (I), R1, R2, and R3 are each independently a C1 to C5 alkyl group, at least one of R1, R2, and R3 being a C1 to C5 alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, M is a niobium atom, a tantalum atom, or a vanadium atom, X is a halogen atom, m is an integer of 3 to 5, and n is 1 or 2.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 16, 2021
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Jaewoon KIM, Gyuhee PARK, Younjoung CHO, Kazuya SAITO, Takanori KOIDE, Yoshiki MANABE, Yutaro AOKI, Hiroyuki UCHIUZOU, Wakana FUSE
  • Publication number: 20200207790
    Abstract: Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
    Type: Application
    Filed: September 9, 2019
    Publication date: July 2, 2020
    Applicants: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Gyu-Hee Park, Takanori Koide, Yoshiki Manabe, Masayuki Kimura, Akio Saito, Jaesoon Lim, Younjoung Cho