Patents by Inventor Yoshiki Manabe

Yoshiki Manabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aluminum compound and method for manufacturing semiconductor device using the same
    Patent number: 11332486
    Abstract: Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: May 17, 2022
    Assignees: SAMSUNG ELECTRONICS CO., LTD., ADEKA CORPORATION
    Inventors: Gyu-Hee Park, Takanori Koide, Yoshiki Manabe, Masayuki Kimura, Akio Saito, Jaesoon Lim, Younjoung Cho
  • MATERIALS FOR FABRICATING THIN FILMS, METHODS OF FABRICATING THIN FILMS USING THE SAME, AND EQUIPMENT FOR FABRICATING THIN FILMS USING THE SAME
    Publication number: 20210380622
    Abstract: Materials for fabricating a thin film that has improved quality and productivity are provided. The materials may include a Group 5 element precursor of formula (1): M1 may be a Group 5 element, each of R1 to R10 independently may be a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or f7onnula (2), R11 may be a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and L1 may be an alkyl group, an alkylamino group, an alkoxy group or an alkylsilyl group, each of which may have 1 to 5 carbon atoms and may be substituted or unsubstituted. Formula (2) may have a structure of Each of Ra to Rc independently may be a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms.
    Type: Application
    Filed: March 29, 2021
    Publication date: December 9, 2021
    Inventors: Seung-Min Ryu, Gyu-Hee Park, Youn Joung Cho, Kazuki Harano, Takanori Koide, Wakana Fuse, Yoshiki Manabe, Yutaro Aoki, Hiroyuki Uchiuzou, Kazuya Saito
  • ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20200207790
    Abstract: Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
    Type: Application
    Filed: September 9, 2019
    Publication date: July 2, 2020
    Applicants: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Gyu-Hee Park, Takanori Koide, Yoshiki Manabe, Masayuki Kimura, Akio Saito, Jaesoon Lim, Younjoung Cho