Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

Abstract: A method for manufacturing a light-emitting element includes providing the light-emitting element that includes a light-emitting layer with an emission wavelength of not more than 306 nm and a p-type layer including AlGaInN including Mg as an acceptor, and removing hydrogen in the p-type layer from the light-emitting element by irradiating the light-emitting element with ultraviolet light at a wavelength of not more than 306 nm from outside and treating the light-emitting element with heat in a state in which a reverse voltage, or a forward voltage lower than a threshold voltage of the light-emitting element, or no voltage is applied to the light-emitting element. The removing of hydrogen in the p-type layer from the light-emitting element is performed in a N2 atmosphere at not less than 650° C. or in a N2+O2 atmosphere at not less than 500° C.

Abstract: A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump formed on the first pad and including a base plating layer and a top plating layer, and a second bump formed on the second conductor pad and including a base plating layer and a top plating layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.

Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

Abstract: A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.

Abstract: A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.

Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

Abstract: A printed wiring board includes a core substrate, a first resin insulating layer formed on a first surface of the core substrate, a second resin insulating layer formed on a second surface of the core substrate on the opposite side of the first surface, an electronic component accommodated in opening portion formed in the core substrate, and a filling resin filling space formed between the electronic component and an inner wall of the opening portion and including resin material that is different from resin material forming the first and second resin insulating layers. The core substrate has a first conductor pattern forming a first outermost layer of the core substrate and a second conductor pattern forming a second outermost layer of the core substrate on the opposite side of the first conductor pattern, and the filling resin is filling spaces formed in the second conductor pattern of the core substrate.

Abstract: An image forming apparatus includes: a conveying unit configured to convey a sheet along a conveyance path group including at least a first conveyance path and a second conveyance path joining the first conveyance path; an image forming unit; and a path switcher, wherein: the path switcher includes: a guide unit configured to rotate about a guide supporting point and rotate between a first position and a second position; a protruding portion fixed to the guide unit; a drive lever having a first pressing surface and a second pressing surface; a first force applying unit; and a second force applying unit; the drive lever includes: a first lever; a second lever; a third force applying unit; and a restraining portion configured to set a moving end on the rotation of the second lever; and the restraining portion restricts the moving end of the second lever to a predetermined position.

Abstract: An image forming device includes: a conveyance unit; an image forming section; a plurality of storage units; and a sheet feeding roller, wherein provided are: one drive source; a first drive transmission system including a first one-way clutch; a second drive transmission system including: a second one-way clutch; and a first transmission interrupting unit; a third drive transmission system including: a third one-way clutch; and a second transmission interrupting unit; and a control unit, and the control unit is configured to: rotationally drive the drive source in the first direction at the time of the sending operation by the first sheet feeding roller; rotationally drive the drive source in the second direction at the time of the sending operation by the second sheet feeding roller; and rotationally drive the drive source in the second direction at the time of the sending operation by the third sheet feeding roller.

Abstract: An image forming device includes: a conveyance unit; an image forming section; a plurality of storage units; and a sheet feeding roller, wherein provided are: one drive source; a first drive transmission system including a first one-way clutch; a second drive transmission system including: a second one-way clutch; and a first transmission interrupting unit; a third drive transmission system including: a third one-way clutch; and a second transmission interrupting unit; and a control unit, and the control unit is configured to: rotationally drive the drive source in the first direction at the time of the sending operation by the first sheet feeding roller; rotationally drive the drive source in the second direction at the time of the sending operation by the second sheet feeding roller; and rotationally drive the drive source in the second direction at the time of the sending operation by the third sheet feeding roller.

Abstract: An image forming apparatus includes: a conveying unit configured to convey a sheet along a conveyance path group including at least a first conveyance path and a second conveyance path joining the first conveyance path; an image forming unit; and a path switcher, wherein: the path switcher includes: a guide unit configured to rotate about a guide supporting point and rotate between a first position and a second position; a protruding portion fixed to the guide unit; a drive lever having a first pressing surface and a second pressing surface; a first force applying unit; and a second force applying unit; the drive lever includes: a first lever; a second lever; a third force applying unit; and a restraining portion configured to set a moving end on the rotation of the second lever; and the restraining portion restricts the moving end of the second lever to a predetermined position.

Abstract: An image of the original document is read rapidly to effect quick production of the first copy even when the function of the shading correction and the function of the color/monochrome judgment operate. A waiting position P2 of a first slider 211 is located on the opposite side from a scan starting position P3 in reference to a reading area for the original document, and a location of a shading correction plate 206 is interposed between the reading area for the original document and the waiting position P2 of the first slider 211. While the first slider 211 is in the process of returning from the waiting position P2 to the scan starting position P3 for the preparation of reading the image of the original, a shading correction and a color/monochrome judgment are carried out for preventing the first slider 211 from having extra motion.

Abstract: Compounds of formula (I):A--M--B-- (I)(in which: M represents a saturated heterocyclic group having from 5 to 7 ring atoms of which 2 are nitrogen atoms, said group being unsubstituted or being substituted at any of its carbon atoms by C.sub.1 -C.sub.6 alkyl and/or oxo substituents: A represents a halo-substituted benzhydryl substituent; and B represents certain specific substituted alkyl groups) and salts thereof are valuable for the treatment and prophylaxis of disorders arising from circulatory problems, especially those affecting the brain. They may be prepared by reacting a compound of formula A--M--H with a halo or acyloxy derivative corresponding to the alkyl substituent B which it is desired to introduce.

Abstract: A numbering device for use in an offset printing machine includes a numbering-impression cylinder which is swingably disposed beside a transfer drum in order to perform a numbering operation simultaneous with an ordinary printing operation and to concurrently perform vertical and/or lateral perforation operations. The offset printing machine comprises a transfer drum positioned beside a main impression cylinder which confronts a blanket cylinder to perform ordinary printing operation; a numbering-impression cylinder; a numbering box supporting cylinder positioned beside the numbering impression cylinder so as to form numbers on a printed sheet, an ink supply in contact with the numbering box supporting cylinder; a perforating device positioned in confrontation with the numbering impression cylinder to provide vertical or longitudinal perforations in the printed sheet; and a synchronous mechanism connected between the cylinders in order to cooperate with a numbering box advancing device.