Patents by Inventor Yoshiki Nakaie
Yoshiki Nakaie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11859058Abstract: Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).Type: GrantFiled: June 6, 2018Date of Patent: January 2, 2024Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Hiroaki Arita
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Publication number: 20230241816Abstract: Prepared is a laminate including: a first layer formed of a first resin composition containing a first resin; and a second layer formed of a second resin composition containing a second resin, the first layer and the second layer being in contact with each other and integrated. The first resin includes an alicyclic polyamide resin having 20 mmol/kg or greater of amino groups, and the second resin includes an acid-modified (meth)acrylic resin. The second resin may have 100 mmol/kg or greater of carboxyl groups. The acid-modified (meth)acrylic resin may be an acid-modified polymethylmethacrylate resin. An average thickness of the first layer may be 0.15 times or more of an average thickness of the second layer. The average thickness of the first layer may be 200 ?m or greater. When a weight is dropped onto the second layer side, the laminate may have a DuPont impact strength of 500 N/inch or greater. The laminate has excellent transparency, lightness, light resistance, and impact resistance.Type: ApplicationFiled: June 9, 2021Publication date: August 3, 2023Applicant: Polyplastics-Evonik CorporationInventors: Mitsuteru MUTSUDA, Toshihiko FUJINAKA, Daisuke FUJIKI, Yoshiki NAKAIE
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Patent number: 11407864Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.Type: GrantFiled: September 27, 2018Date of Patent: August 9, 2022Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Takayuki Uno
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Patent number: 11142613Abstract: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 ?m and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 ?m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).Type: GrantFiled: April 10, 2017Date of Patent: October 12, 2021Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Takayuki Uno
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Patent number: 11066529Abstract: Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).Type: GrantFiled: June 6, 2018Date of Patent: July 20, 2021Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Hiroaki Arita
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Publication number: 20200207931Abstract: Provided are: a water-soluble matrix whose melt-kneading temperature can be adjusted according to the melting point or glass transition temperature of a resin; a pre-molded article in which resin particles are dispersed in the water-soluble matrix; and a method for producing resin particles. This production method includes melt-kneading a water-soluble matrix containing a modified polyvinyl alcohol-based resin and a water-soluble saccharide at a weight ratio of the former/the latter=from 99/1 to 50/50 and a thermoplastic resin, and bringing the pre-molded article in which the resin particles are dispersed into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).Type: ApplicationFiled: June 6, 2018Publication date: July 2, 2020Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Hiroaki ARITA
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Publication number: 20200079916Abstract: Provided is a method for producing resin particles by melt-kneading with a non-water-soluble resin in a wide range of melt-kneading temperature according to the melting point or glass transition temperature of the resin. This production method includes melt-kneading a water-soluble matrix, containing a modified polyvinyl alcohol-based resin, and a non-water-soluble resin to form a pre-molded article in which the non-water-soluble resin is dispersed in particulate; and bringing the pre-molded article into contact with an aqueous solvent to elute the matrix. The modified polyvinyl alcohol-based resin contains in a side chain thereof an alkyl group including at least one hydroxyl group (for example, a 1,2-dihydroxyalkyl group).Type: ApplicationFiled: June 6, 2018Publication date: March 12, 2020Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Hiroaki ARITA
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Patent number: 10370509Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.Type: GrantFiled: October 5, 2016Date of Patent: August 6, 2019Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Yoshiki Nakaie, Takayuki Uno
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Publication number: 20190161587Abstract: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 ?m and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 ?m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).Type: ApplicationFiled: April 10, 2017Publication date: May 30, 2019Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
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Publication number: 20190048153Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.Type: ApplicationFiled: September 27, 2018Publication date: February 14, 2019Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
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Publication number: 20180258240Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.Type: ApplicationFiled: October 5, 2016Publication date: September 13, 2018Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
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Patent number: 9233065Abstract: Disclosed is a method for producing resin particles, which can impart a desired function to the surface of resin particles efficiently and simply. Also disclosed are resin particles produced by the method. The method produces resin particles by melting and mixing an acidic-group-containing thermoplastic resin or elastomer with filler particles and a water-soluble material to give a resin composition containing resin fine particles formed by the thermoplastic resin and the filler particles and dispersed in a matrix including the water-soluble material; and removing the matrix component from the resin composition, to give the resin particles. The resulting resin particles each include a core particle including the acidic-group-containing thermoplastic resin or elastomer, and the filler particles immobilized on the outside of the core particle. The acidic group is preferably carboxyl group or carboxylic anhydride group.Type: GrantFiled: May 22, 2008Date of Patent: January 12, 2016Assignee: DAICEL-EVONIK LTD.Inventors: Hideki Matsui, Yoshiki Nakaie, Hajime Komada
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Patent number: 9127186Abstract: A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C8-16alkylene group (e.g., a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The film sealant may cover one side of the device.Type: GrantFiled: September 21, 2011Date of Patent: September 8, 2015Assignee: DAICEL-EVONIK LTD.Inventors: Hiroaki Arita, Yoshiki Nakaie, Taiji Yamabe
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Publication number: 20150024224Abstract: A paste sealant capable of shortening sealing and molding cycles in spite of containing an aqueous medium and a sealing method of using the sealant are provided. The paste sealant for molding and sealing a device comprises a copolyamide-series resin and an aqueous medium. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The paste sealant may further contain a thickener [e.g., a (meth)acrylic polymer].Type: ApplicationFiled: March 8, 2013Publication date: January 22, 2015Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
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Publication number: 20150024130Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for sealing a device comprises a copolyamide-series resin powder having a particle diameter of not more than 1 mm. The copolyamide-series resin powder contains at least a fine particle (e.g., a copolyamide-series resin particle having an average particle diameter of 20 to 400 ?m), or may contain the fine particle in combination with a coarse particle (e.g., a copolyamide-series resin particle having an average particle diameter of 450 to 800 ?m). The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be, e.g., a binary or ternary copolymer.Type: ApplicationFiled: February 8, 2013Publication date: January 22, 2015Applicant: Daicel-Evonik Ltd.Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
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Publication number: 20130177704Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for molding and sealing a device comprises a copolyamide-series resin powder. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid).Type: ApplicationFiled: September 21, 2011Publication date: July 11, 2013Applicant: DAICEL-EVONIK LTD.Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
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Publication number: 20130171440Abstract: A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C8-16alkylene group (e.g., a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The film sealant may cover one side of the device.Type: ApplicationFiled: September 21, 2011Publication date: July 4, 2013Applicant: DAICEL-EVONIK LTD.Inventors: Hiroaki Arita, Yoshiki Nakaie, Taiji Yamabe
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Publication number: 20110244007Abstract: Disclosed are a method for manufacturing spherical composite particles, by which desired functions are simply and efficiently imparted to the surface or inside of the spherical composite particles; and spherical composite particles obtained by the method.Type: ApplicationFiled: November 27, 2009Publication date: October 6, 2011Inventors: Hideki Matsui, Yoshiki Nakaie, Hajime Komada
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Publication number: 20100178309Abstract: Disclosed is a method for producing resin particles, which can impart a desired function to the surface of resin particles efficiently and simply. Also disclosed are resin particles produced by the method. The method produces resin particles by melting and mixing an acidic-group-containing thermoplastic resin or elastomer with filler particles and a water-soluble material to give a resin composition containing resin fine particles formed by the thermoplastic resin and the filler particles and dispersed in a matrix including the water-soluble material; and removing the matrix component from the resin composition, to give the resin particles. The resulting resin particles each include a core particle including the acidic-group-containing thermoplastic resin or elastomer, and the filler particles immobilized on the outside of the core particle. The acidic group is preferably carboxyl group or carboxylic anhydride group.Type: ApplicationFiled: May 22, 2008Publication date: July 15, 2010Inventors: Hideki Matsui, Yoshiki Nakaie, Hajime Komada
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Publication number: 20070232753Abstract: A process for production of a powder suitable for use in a process for the layer-by-layer moldless production of a three-dimensional shaped article, in which regions of the respective powder layer are selectively melted via input of electromagnetic energy, comprising mixing of a polymer or copolymer with at least one water-soluble polymeric polyol, the dissolution of the mixture in water to form a dispersion, the isolation of the polymer particles or copolymer particles from the dispersion, and the washing and drying of the isolated polymer particles or isolated copolymer particles; a powder which comprises a polymer powder or copolymer powder with from 0.001% by weight to 5% by weight content of at least one polymeric polyol, the polymeric polyol having been selected from the group consisting of polyethylene glycols and polyvinyl alcohols; the powder formed from the process; method of using the powder; and a shaped article formed from the powder.Type: ApplicationFiled: March 30, 2007Publication date: October 4, 2007Applicant: DEGUSSA GmbHInventors: Sylvia MONSHEIMER, Hajime Komada, Hideki Matsui, Yoshiki Nakaie