Patents by Inventor Yoshiki Oshida

Yoshiki Oshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding bodies made of metallic material
    Patent number: 3963163
    Abstract: A method for bonding bodies made of metallic material is described herein, which method is characterized in that one ends of metallic bodies are butted against each other with a light mechanical load applied to the butted portion, and under such a loaded condition the proximity of said butted portion is subjected to a temperature cycle passing over a transformation point of said materials, whereby said metallic bodies may be pressure bonded while super-plastic phenomena are generated in said butted portion of said metallic bodies.
    Type: Grant
    Filed: January 13, 1975
    Date of Patent: June 15, 1976
    Assignee: Mitsubishi Jukogyo Kabushiki Kaisha
    Inventor: Yoshiki Oshida