Patents by Inventor Yoshiki Sawaki

Yoshiki Sawaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7332798
    Abstract: Provided is a non-contact ID card which is superior in the productivity and the electrical properties, and a method capable of manufacturing such non-contact ID card. The non-contact ID card of the present invention is characterized in that the non-contact ID card comprises an antenna circuit board in which an antenna is formed on a substrate and an interposer board in which an enlarged electrode, which is connected to an electrode of an IC chip, is formed on a substrate on which the IC chip is mounted. The non-contact ID card is formed by laminating both boards in such a manner that the electrode of the antenna and the enlarged electrode are bonded, in which both electrodes are adhesively bonded by an insulating adhesive filled in minute recesses dispersed on bonding faces of the electrode of the antenna and/or the enlarged electrode.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: February 19, 2008
    Assignee: Toray Engineering Company, Limited
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Patent number: 7275696
    Abstract: A low-cost non-contact ID card having practical electrical properties and the like is disclosed. The non-contact ID card comprises an antenna circuit board wherein an antenna is formed on a substrate and an interposer board wherein an enlarged electrode is formed on a substrate that is mounted with an IC chip. The enlarged electrode is connected to an electrode of the IC chip. The antenna circuit board and the interposer board are joined in such a manner that an electrode of the antenna is in direct contact with the enlarged electrode which is a resin electrode made of a conductive resin containing a thermoplastic resin.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: October 2, 2007
    Assignee: Toray Engineering Company, Limited
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Publication number: 20070171619
    Abstract: Adverse affects due to a failure interposer board and a blank section are prevented from occurrence by arranging only conforming interposer boards on a carrier tape at every predetermined interval.
    Type: Application
    Filed: December 24, 2004
    Publication date: July 26, 2007
    Applicant: Toray Engineering Co., Ltd.
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Publication number: 20060279941
    Abstract: Provided is a non-contact ID card which is superior in the productivity and the electrical properties, and a method capable of manufacturing such non-contact ID card. The non-contact ID card of the present invention is characterized in that the non-contact ID card comprises an antenna circuit board in which an antenna is formed on a substrate and an interposer board in which an enlarged electrode, which is connected to an electrode of an IC chip, is formed on a substrate on which the IC chip is mounted. The non-contact ID card is formed by laminating both boards in such a manner that the electrode of the antenna and the enlarged electrode are bonded, in which both electrodes are adhesively bonded by an insulating adhesive filled in minute recesses dispersed on bonding faces of the electrode of the antenna and/or the enlarged electrode.
    Type: Application
    Filed: November 9, 2004
    Publication date: December 14, 2006
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Publication number: 20060054707
    Abstract: A low-cost non-contact ID card having practical electrical properties and the like is disclosed. The non-contact ID card comprises an antenna circuit board wherein an antenna is formed on a substrate and an interposer board wherein an enlarged electrode is formed on a substrate that is mounted with an IC chip. The enlarged electrode is connected to an electrode of the IC chip. The antenna circuit board and the interposer board are joined in such a manner that an electrode of the antenna is in direct contact with the enlarged electrode which is a resin electrode made of a conductive resin containing a thermoplastic resin.
    Type: Application
    Filed: October 23, 2003
    Publication date: March 16, 2006
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Publication number: 20050110129
    Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.
    Type: Application
    Filed: December 20, 2004
    Publication date: May 26, 2005
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Patent number: 6882545
    Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: April 19, 2005
    Assignee: Toray Engineering Company, Limited
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Publication number: 20040037053
    Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.
    Type: Application
    Filed: March 13, 2003
    Publication date: February 26, 2004
    Inventors: Masanori Akita, Yoshiki Sawaki