Patents by Inventor Yoshiki Seto
Yoshiki Seto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10772836Abstract: A method for producing particles, the method including: applying vibration to a liquid including a physiologically active substance and included in a liquid-column resonance liquid-chamber to form a standing wave based on liquid column resonance, to thereby discharge the liquid from at least one discharging port, which is formed in an amplitude direction of the standing wave, to at least one region corresponding to at least one anti-node of the standing wave; and drying the liquid discharged, to thereby form particles.Type: GrantFiled: March 2, 2017Date of Patent: September 15, 2020Assignees: RICOH COMPANY, LTD., SHIZUOKA PREFECTURAL UNIVERSITY CORPORATIONInventors: Satomi Onoue, Hideyuki Sato, Yoshiki Seto, Tatsuru Moritani, Tadahiko Morinaga
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Publication number: 20190076361Abstract: A method for producing particles, the method including: applying vibration to a liquid including a physiologically active substance and included in a liquid-column resonance liquid-chamber to form a standing wave based on liquid column resonance, to thereby discharge the liquid from at least one discharging port, which is formed in an amplitude direction of the standing wave, to at least one region corresponding to at least one anti-node of the standing wave; and drying the liquid discharged, to thereby form particles.Type: ApplicationFiled: March 2, 2017Publication date: March 14, 2019Applicants: RICOH COMPANY, LTD., SHIZUOKA PREFECTURAL UNIVERSITY CORPORATIONInventors: Satomi ONOUE, Hideyuki SATO, Yoshiki SETO, Tatsuru MORITANI, Tadahiko MORINGA
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Publication number: 20180240930Abstract: A method of manufacturing a lead wire for a solar cell includes heating a wire material by a direct resistance heating or by an induction heating to reduce a 0.2% proof stress of the wire material while conveying the wire material and plating the wire material that is in a heated condition obtained by the direct resistance heating or by the induction heating while further conveying the wire material. An apparatus is configured to implement the method, and includes a plating bath, a conveyor mechanism configured to convey the wire material, a heater configured to heat the wire material, and a controller configured to control the conveyor mechanism and the heater.Type: ApplicationFiled: April 23, 2018Publication date: August 23, 2018Inventors: Yoshiki SETO, Kunihiro KOBAYASHI, Nobumoto ISHIKI, Hisaaki WATANABE
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Patent number: 9991410Abstract: A method of manufacturing a lead wire for a solar cell includes heating a wire material by a direct resistance heating or by an induction heating to reduce a 0.2% proof stress of the wire material while conveying the wire material and plating the wire material that is in a heated condition obtained by the direct resistance heating or by the induction heating while further conveying the wire material. An apparatus is configured to implement the method, and includes a plating bath, a conveyor mechanism configured to convey the wire material, a heater configured to heat the wire material, and a controller configured to control the conveyor mechanism and the heater.Type: GrantFiled: September 28, 2012Date of Patent: June 5, 2018Assignee: NETUREN CO., LTD.Inventors: Yoshiki Seto, Kunihiro Kobayashi, Nobumoto Ishiki, Hisaaki Watanabe
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Publication number: 20140357015Abstract: A method of manufacturing a lead wire for a solar cell includes heating a wire material by a direct resistance heating or by an induction heating to reduce a 0.2% proof stress of the wire material while conveying the wire material and plating the wire material that is in a heated condition obtained by the direct resistance heating or by the induction heating while further conveying the wire material. An apparatus is configured to implement the method, and includes a plating bath, a conveyor mechanism configured to convey the wire material, a heater configured to heat the wire material, and a controller configured to control the conveyor mechanism and the heater.Type: ApplicationFiled: September 28, 2012Publication date: December 4, 2014Inventors: Yoshiki Seto, Kunihiro Kobayashi, Nobumoto Ishiki, Hisaak Watanabe
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Publication number: 20140224387Abstract: A method of annealing a copper wire for an interconnector includes heating a copper wire by a direct resistance heating or by an induction heating, a heating temperature of the heating being in a range of 650° C. to 1020° C., and a heating time of the heating being in a range of 0.3 seconds to 5 seconds.Type: ApplicationFiled: September 28, 2012Publication date: August 14, 2014Applicant: Neturen Co., LTD.Inventors: Yoshiki Seto, Kunihiro Kobayashi, Nobumoto Ishiki, Hisaaki Watanabe
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Patent number: 7147731Abstract: A spacer 44 is inserted between an upper end face 44a of a contact column 40, and a lower face of a flange 14. The flange 14 is supported at plural positions by supporting columns 42. In heating a shoulder portion 16 to a hardening temperature, an electroconductive member 56 is placed close to the shoulder portion 16, and an AC current having a frequency which will cause mutual attraction between the current flowing through the elctroconductive member 56 and the current flowing through the shoulder portion 16 is applied to flow through the electroconductive member 56. The shoulder portion 16 having been heated to the hardening temperature is quenched by ejecting a liquid coolant through ejection outlets of a cooling jacket.Type: GrantFiled: March 27, 2002Date of Patent: December 12, 2006Assignee: Neturen Co., Ltd.Inventors: Yoshimasa Tanaka, Katsumi Ohmiya, Yoshiki Seto, Yoichi Mori
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Patent number: 7119309Abstract: A liquid phase diffusion bonding method for dissimilar metal sheets by allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the sheets at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the sheets at predetermined distances from the sheets, respectively.Type: GrantFiled: February 10, 2005Date of Patent: October 10, 2006Assignees: Nissan Motor Co., Ltd., Neturen Co., Ltd.Inventors: Takashi Matsuoka, Kiyokazu Mori, Yoshiki Seto, Tsunetaka Takeuchi, Takahiko Kanai
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Publication number: 20050178819Abstract: A liquid phase diffusion bonding method for dissimilar metal sheets of the present invention has the steps of: allowing a galvanized steel sheet and an aluminum alloy sheet to come into close contact with each other and pressing both sheets by using a first mold of a liquid phase diffusion bonding apparatus and a second mold of the same; and heating the galvanized steel sheet and the aluminum alloy sheet at approximately the same heat-up rate and at approximately the same temperature to perform liquid phase diffusion bonding of the sheets by using induction heat generated by applying high frequency currents to a first high frequency induction heating coil provided on the first mold and a second high frequency induction heating coil provided on the second mold. The first high frequency induction heating coil and the second high frequency induction heating coil are positioned to sandwich the galvanized steel sheet and the aluminum alloy sheet at predetermined distances from the sheets, respectively.Type: ApplicationFiled: February 10, 2005Publication date: August 18, 2005Inventors: Takashi Matsuoka, Kiyokazu Mori, Yoshiki Seto, Tsunetaka Takeuchi, Takahiko Kanai
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Publication number: 20040169321Abstract: A spacer 44 is inserted between an upper end face 44a of a contact column 40, and a lower face of a flange 14. The flange 14 is supported at plural positions by supporting columns 42. In heating a shoulder portion 16 to a hardening temperature, an electroconductive member 56 is placed close to the shoulder portion 16, and an AC current having a frequency which will cause mutual attraction between the current flowing through the elctroconductive member 56 and the current flowing through the shoulder portion 16 is applied to flow through the electroconductive member 56. The shoulder portion 16 having been heated to the hardening temperature is quenched by ejecting a liquid coolant through ejection outlets of a cooling jacket.Type: ApplicationFiled: March 1, 2004Publication date: September 2, 2004Inventors: Yoshimasa Tanaka, Katsumi Ohmiya, Yoshiki Seto, Yoichi Mori
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Patent number: 6328829Abstract: Hardening is accomplished by heating a longitudinal section of a workpiece such as an odd-shaped bar, and by quenching while constraining the workpiece section in dies. The quenching is executed while the workpiece is pressed in a direction perpendicular to its longitudinal direction by a pressing device which is installed adjacent to the workpiece section constrained in the dies. Warping by quenching can thus be minimized in odd-shaped workpieces, such as an automobile steering rack bar.Type: GrantFiled: October 4, 1999Date of Patent: December 11, 2001Assignee: Neturen Co., Ltd.Inventors: Junichi Kato, Yoshiki Seto, Tetsukazu Fukuhara, Yugo Yao
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Patent number: 5626693Abstract: This invention provides a method and apparatus for quenching a tubular workpiece such as cylindrical tubes or different-shaped tubes, which are difficult to be exerted constraining force for preventing warping especially in case of thinner thickness. Warping is prevented by applying a constraining force which is increased from beginning of the quenching to termination thereof, corresponding to increase of elasticity limit stress in accordance with temperature drop of the workpiece. Furthermore, apparatus for carrying out the method for quenching a tubular workpiece are offered, wherein the apparatus are provided with a pressure controller for pressure rolls or dies, thereby the pressure controller changes setting input for the pressure during the quenching.Type: GrantFiled: July 19, 1995Date of Patent: May 6, 1997Assignee: Neturen Co., Ltd.Inventors: Yugo Yao, Tetsukazu Fukuhara, Yoshiki Seto, Junichi Kato
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Patent number: 5492308Abstract: A constrained quenching apparatus is provided for hardening a workpiece such as an asymmetrical bar which has a notable tendency to warping when quenched, without warping the workpiece. The apparatus comprises a set of two or more dies having plural projections provided on the inner side thereof, the projections coinciding with the contour of the workpiece when the dies are closed so that their die faces in contact with one another, and having plural recesses therein defined by the projections. The recesses are provided with one or more cooling liquid blow holes. The apparatus does not exert pressure on the workpiece at the start of the quenching when the workpiece is soft, so the flattening of the hollow workpiece such as a pipe, can be prevented.Type: GrantFiled: August 26, 1994Date of Patent: February 20, 1996Assignee: Neturen Co., Ltd.Inventors: Yugo Yao, Yoshiki Seto, Junichi Kato
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Patent number: 4943036Abstract: The present invention is drawn to a method and apparatus for holding wire at a specified temperature for a specified period of time by a direct-resistance heating device which applies such voltage as to generate Joule's heat in the wire, sufficient to offset the quantity of heat that would tend to be released from the heated wire during unforced cooling, after the travelling wire is heated rapidly to a specified temperature throughout its cross section.Type: GrantFiled: October 12, 1988Date of Patent: July 24, 1990Assignee: Neturen Company LimitedInventors: Hiroki Sato, Yoshiki Seto