Patents by Inventor Yoshiki SHIRASU

Yoshiki SHIRASU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250006764
    Abstract: Improvement of pixel characteristics is achieved. A light detecting device includes a semiconductor layer and first and second separation areas disposed in the semiconductor layer. The first separation area includes an insulating film that fills a first dug part extending in a thickness direction of the semiconductor layer and of which a refractive index is lower than that of the semiconductor layer, and the second separation area includes a conductive film filling a second dug part extending in the thickness direction of the semiconductor layer.
    Type: Application
    Filed: November 25, 2022
    Publication date: January 2, 2025
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Kyohei MIZUTA, Yoshiki EBIKO, Yasufumi MIYOSHI, Kenji TAKEO, Tokihisa KANEGUCHI, Hokuto MIKI, Yoshiki SHIRASU, Tadamasa SHIOYAMA, Toshihiko HAYASHI, Naoyuki SATO
  • Publication number: 20240290813
    Abstract: An optical detection device including a through electrode is provided. The optical detection device includes a first semiconductor layer having a photoelectric conversion region, a first surface, and a second surface that is a light entrance surface, a second semiconductor layer with a third surface and a fourth surface, a second wiring layer overlapped with the third surface, a third wiring layer overlapped with the fourth surface, a first wiring layer with one surface overlapped with the first surface and another surface overlapped with one of the second wiring layer and the third wiring layer, a first conductor that has a first width, includes a first material, and penetrates the second semiconductor layer in a thickness direction, and a second conductor that has a second width smaller than the first width, includes a second material different from the first material, and penetrates the second semiconductor layer in the thickness direction.
    Type: Application
    Filed: June 16, 2022
    Publication date: August 29, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masaki HANEDA, Kengo KOTOO, Yoshiki SHIRASU, Kazuki SHIMOMURA, Nobutoshi FUJII, Takaaki HIRANO, Yosuke FUJII, Takashi OINOUE, Suguru SAITO, Toshiyuki ISHIMARU, Keiji OHSHIMA, Shinichi IMAI, Takuya KUROTORI, Tomohiro SUGIYAMA, Ikue MITSUHASHI, Kenichi TOKUOKA