Abstract: Provided is a microfluidic chip capable of suppressing contamination while downsizing a device. A microfluidic chip 1 includes a chip main body 2, and an optical gas generation tape 8 attached to the chip main body 2 and configured to generate a gas by light irradiation, in which the chip main body 2 includes a microchannel 4, a liquid medium reservoir 5 provided in the middle of the microchannel 4, and a cell binding unit 6 provided on a downstream side of the liquid medium reservoir 5 in the microchannel 4, and a liquid medium stored in the liquid medium reservoir 5 is supplied to the cell binding unit 6 by the gas generated from the optical gas generation tape 8.

Abstract: To provide a cell culture scaffold material capable of enhancing adhesiveness of cells. The cell culture scaffold material according to the present invention contains a peptide-conjugated acrylic resin, in which the peptide-conjugated acrylic resin has a first structural part having no peptide portion in a side chain and a second structural part having a peptide portion in a side chain, and solubility parameter calculated by Okitsu's equation for the first structural part is 9.7 (cal/cm3)1/2 or more and 10.7 (cal/cm3)1/2 or less.

Abstract: In a capacitor module, a capacitor, a seal member that seals the capacitor, an electronic element electrically connected to the capacitor, a temperature sensor that measures a temperature around the capacitor, and a wire member electrically connected to the temperature sensor are provided. A holder holds at least the electronic element, the temperature sensor, and the wire member. The holder is fixed to the seal member while the temperature sensor is located between the electronic element and at least part of the capacitor via the seal member.

Abstract: In a capacitor module, a capacitor, a seal member that seals the capacitor, an electronic element electrically connected to the capacitor, a temperature sensor that measures a temperature around the capacitor, and a wire member electrically connected to the temperature sensor are provided. A holder holds at least the electronic element, the temperature sensor, and the wire member. The holder is fixed to the seal member while the temperature sensor is located between the electronic element and at least part of the capacitor via the seal member.

Abstract: A device for detecting a temperature of a cooling liquid includes a cooling section having a cooling liquid flowing therein, a temperature sensor which detects a temperature of the cooling liquid, and a bracket, which supports the temperature sensor, is braze-bonded to the cooling section, and transfers heat of the cooling liquid to the temperature sensor. The bracket has formed therein a slit that communicates between the outside and a bonding surface bonded to the cooling section. With this configuration, deterioration of heat conductivity due to the braze-bonding can be suppressed.

Abstract: A heat exchange apparatus includes: a main body including a top panel and a bottom panel, the top panel superposed on top of the bottom panel to define a heat carrier passage therebetween; a bracket fixed to an outside surface of the top panel; a shaft member fixed to the bracket; a temperature sensor support board including a penetration portion penetrated by the shaft member; a temperature sensor fixed to the temperature sensor support board; and a pressing member disposed at a distal end of the shaft member penetrating through the temperature sensor support board and pressing down the temperature sensor support board onto the bracket. The shaft member penetrating through the temperature sensor support board is disposed at a position to face the heat carrier passage via the top panel.

Abstract: A method of brazing a heat sink includes: fitting at least a part of a bottom plate between protruding opposite ends of a top plate; fixing a jig to an outer periphery of the top plate in order to prevent the top plate that thermally expands from extending outward in a width direction of the top plate; and braze-bonding an inner side surface of the top plate to a side surface of the bottom plate, which faces the inner side surface of the top plate.