Abstract: An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.

Abstract: In an electronic component having a built-in coil composed of coil conductors with a length of one turn, the inductance value can be increased while suppressing generation of short circuits inside the coil conductors. The electronic component includes a multilayer body formed by stacking a plurality of magnetic layers on top of one another. The built-in coil includes coil conductors and via hole conductors. The coil conductors each have a ring-shaped coil portion having a cut out portion in one side of one corner thereof, and a connecting portion that form an obtuse angle with a side extending from one end portion of the coil portion and is positioned in a region enclosed or surrounded by the coil portion. Via hole conductors connect the plurality of coil conductors to one another.

Abstract: A multilayer coil device is formed by alternately stacking a plurality of insulating layers and a plurality of substantially spiral coil patterns. In the multilayer coil device, the number of turns of each of the substantially spiral coil patterns is more than one. Each of the substantially spiral coil patterns has a protrusion protruding toward a center of the substantially spiral coil pattern. The protrusion is located in a specific region where the number of coil pattern portions that cross a virtual line extending radially outward from the center of the coil pattern is smaller than that in another region of the substantially spiral coil pattern. The protrusion is provided as an additional part of a coil pattern portion that is closest to the center of the substantially spiral coil pattern in the specific region.

Abstract: This disclosure provides a laminated inductor capable of suppressing concentration of magnetic gap portions, preventing local magnetic saturation, and obtaining excellent DC superposition characteristics. In an embodiment of a laminated inductor, magnetic layers and coil conductors are alternately laminated. The laminated inductor includes plural first mixed layers and plural second mixed layers. Each first mixed layer includes a first nonmagnetic material portion between ones of the conductive patterns overlapping in a lamination direction and a second nonmagnetic material portion that is inside the coil conductor and connected to the first nonmagnetic material portion. Each second mixed layer includes a nonmagnetic material portion between ones of the conductive patterns overlapping in the lamination direction and a nonmagnetic material portion that is outside the coil conductor and is connected to the first nonmagnetic material portion.

Abstract: This disclosure provides a laminated inductor capable of suppressing concentration of magnetic gap portions, preventing local magnetic saturation, and obtaining excellent DC superposition characteristics. In an embodiment of a laminated inductor, magnetic layers and coil conductors are alternately laminated. The laminated inductor includes plural first mixed layers and plural second mixed layers. Each first mixed layer includes a first nonmagnetic material portion between ones of the conductive patterns overlapping in a lamination direction and a second nonmagnetic material portion that is inside the coil conductor and connected to the first nonmagnetic material portion. Each second mixed layer includes a nonmagnetic material portion between ones of the conductive patterns overlapping in the lamination direction and a nonmagnetic material portion that is outside the coil conductor and is connected to the first nonmagnetic material portion.

Abstract: In an electronic component having a built-in coil composed of coil conductors with a length of one turn, the inductance value can be increased while suppressing generation of short circuits inside the coil conductors. The electronic component includes a multilayer body formed by stacking a plurality of magnetic layers on top of one another. The built-in coil includes coil conductors and via hole conductors. The coil conductors each have a ring-shaped coil portion having a cut out portion in one side of one corner thereof, and a connecting portion that form an obtuse angle with a side extending from one end portion of the coil portion and is positioned in a region enclosed or surrounded by the coil portion. Via hole conductors connect the plurality of coil conductors to one another.

Abstract: A multilayer coil device is formed by alternately stacking a plurality of insulating layers and a plurality of substantially spiral coil patterns. In the multilayer coil device, the number of turns of each of the substantially spiral coil patterns is more than one. Each of the substantially spiral coil patterns has a protrusion protruding toward a center of the substantially spiral coil pattern. The protrusion is located in a specific region where the number of coil pattern portions that cross a virtual line extending radially outward from the center of the coil pattern is smaller than that in another region of the substantially spiral coil pattern. The protrusion is provided as an additional part of a coil pattern portion that is closest to the center of the substantially spiral coil pattern in the specific region.

Abstract: An electronic component includes a multilayer composite including first insulating layers, second insulating layers, and a helical coil. The helical coil is disposed within the multilayer composite and includes a plurality of coil conductors connected to each other with a plurality of via hole conductors. The coil is located corresponding to the region defined by the second insulating layers when viewed in a stacking direction of the first and second insulating layers. The second insulating layers are located in the region coinciding with the locus of the coil without covering the via hole conductors when viewed in the stacking direction.