Abstract: A parallel driving device that drives parallel-connected semiconductor elements includes a control unit and a gate driving circuit. The control unit detects a temperature difference between the semiconductor elements on the basis of detected values by temperature sensors that detect temperatures of the individual semiconductor elements. The control unit generates a control signal for changing the timing at which to turn on a first semiconductor element specified from the semiconductor elements on the basis of the temperature difference. The gate driving circuit generates a first driving signal for driving the semiconductor elements, and generates a second driving signal that is the first driving signal delayed on the basis of the control signal, and applies the second driving signal to the first semiconductor element.

Abstract: The pilot suspension apparatus of the present invention is capable of biasing a damping valve in a direction for closing the valve, due to application of a pilot pressure. The suspension apparatus comprises at least one pair of hydraulic shock absorbers which are capable of controlling a damping force and which are connected by a connecting pipe. The at least one pair of hydraulic shock absorbers are provided at front and rear wheels or left and right wheels on the same side of a vehicle or are provided in a diagonally shaped relationship. A control valve is provided so as to control the pilot pressure. The control valve is adapted to be controlled by application of a differential pressure which is generated between respective cylinders of the at least one pair of shock absorbers.