Patents by Inventor Yoshiko NAKASHIMA

Yoshiko NAKASHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955959
    Abstract: A parallel driving device that drives parallel-connected semiconductor elements includes a control unit and a gate driving circuit. The control unit detects a temperature difference between the semiconductor elements on the basis of detected values by temperature sensors that detect temperatures of the individual semiconductor elements. The control unit generates a control signal for changing the timing at which to turn on a first semiconductor element specified from the semiconductor elements on the basis of the temperature difference. The gate driving circuit generates a first driving signal for driving the semiconductor elements, and generates a second driving signal that is the first driving signal delayed on the basis of the control signal, and applies the second driving signal to the first semiconductor element.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: April 9, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasushi Nakayama, Yoshiko Tamada, Takayoshi Miki, Shota Morisaki, Yukio Nakashima, Kenta Uchida, Keisuke Kimura, Tomonobu Mihara
  • Publication number: 20240059049
    Abstract: A light modulating device includes a first transparent substrate, a second transparent substrate, a light modulating cell disposed between the first transparent substrate and the second transparent substrate, a first bonding layer disposed between the first transparent substrate and the light modulating cell, and a second bonding layer disposed between the second transparent substrate and the light modulating cell. The first bonding layer and the second bonding layer each are a bonding element containing a non-pressure-sensitive adhesive component. The first bonding layer is an OCR, and the second bonding layer is an OCA.
    Type: Application
    Filed: December 22, 2021
    Publication date: February 22, 2024
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Takao IKEZAWA, Isamu SHIRAISHI, Atsushi TAMAKI, Hirofumi HAYASHI, Katsumi OKABE, Yoshiko NAKASHIMA