Abstract: A robot system includes: a robot control unit that controls an operation of a robot, using a control parameter for the robot; a safety monitoring unit that monitors the operation of the robot, using a safety monitoring parameter for the robot; a control parameter setting unit that sets the control parameter to the robot control unit; and a safety monitoring parameter setting unit that acquires the control parameter set to the robot control unit, from the robot control unit, and sets at least one of a plurality of parameters included in the acquired control parameter, as the safety monitoring parameter to the safety monitoring unit.

Abstract: A control apparatus includes an angle control unit configured to change an angle between an imaging plane of an image sensor and a plane orthogonal to an optical axis of an imaging lens, an acquisition unit configured to acquire positional information of a specific area of an image, and a management unit configured to change the positional information based on the angle.

Abstract: A control apparatus includes an angle control unit configured to change an angle between an imaging plane of an image sensor and a plane orthogonal to an optical axis of an imaging lens, an acquisition unit configured to acquire positional information of a specific area of an image, and a management unit configured to change the positional information based on the angle.

Abstract: A wideband noise reducing device has a three level structure including a magnetic member comprising at least one magnetic film, and first and second boards disposed on both sides of the magnetic member so that the magnetic member is sandwiched between the first and second boards. Each of the first and second boards has a signal pattern portion. The signal pattern portions of the first and second boards are connected with each other to form a signal line wound around the magnetic member.

Abstract: Disclosed is a semiconductor integrated circuit wherein a logic circuit for exchanging signals with RAMS, with the RAMS being disposed centrally on the semiconductor chip or substrate, is divided into a plurality of logic circuits in accordance with the kind of signals and the divided logic circuits are disposed around the RAM in such a manner as to minimize the distance of signal transmission paths with the RAM and in order to attain high speed access to RAMS.

Abstract: Disclosed is a semiconductor integrated circuit wherein a logic circuit for exchanging signals with RAMS, with the RAMS being disposed centrally on the semiconductor chip or substrate, is divided into a plurality of logic circuits in accordance with the kind of signals and the divided logic circuits are disposed around the RAM in such a manner as to minimize the distance of signal transmission paths with the RAM and in order to attain high speed access to RAMS.