Abstract: A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.

Abstract: A holding mechanism includes a Bernoulli pad that holds a plate-shaped body, a hand on which the Bernoulli pad is disposed, a sensor that is disposed on the hand and detects that the plate-shaped body is held under suction by the Bernoulli pad, a lateral movement restriction section disposed on the hand, a tube that connects an air source supplying air to the Bernoulli pad and the Bernoulli pad, an adjustment valve that is disposed in the tube and adjusts a flow rate of air supplied to the Bernoulli pad, and a control section that controls operation of the adjustment valve. The control section gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad and, when it is detected by the sensor that the plate-shaped body has been held under suction by the Bernoulli pad, fixes the flow rate of the air.

Abstract: A protective member forming apparatus includes an integrating unit that integrates a resin sheet held by a chuck table with a wafer by a resin, a conveying unit that conveys the wafer, and a cutting unit that holds, by a cutting table, the wafer integrated with the resin sheet conveyed by the conveying unit and cuts the resin sheet by a cutting section along the wafer. The cutting unit includes a detection unit that images the wafer by a camera and detects a position of a periphery of the wafer, and a control unit that causes cutting of the resin sheet by the cutting section to be performed only in the case where a peripheral edge of the wafer detected coincides with a track of a cutter blade of the cutting section when the preset resin sheet is cut.

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

Abstract: A processing apparatus includes a chuck table having a holding surface for holding a workpiece; a horizontal moving mechanism that moves the chuck table in a horizontal direction and is supplied with a first oil; and a vertical moving mechanism that moves a processing unit in a vertical direction and is supplied with a second oil. Before mounting the workpiece on the holding surface, the holding surface is imaged by a camera while being irradiated with light, and it is examined whether or not the picked-up image is emitting light. If there is a light-emitting part in the picked-up image, it is determined that oil is adhered to the light-emitting part.

Abstract: A resin coating applying apparatus includes a housing, a lid, a lid actuator for actuating the lid openably and closably with respect to the housing, a resin supply for supplying a solid resin to a workpiece, a vacuum pump for evacuating a processing space hermetically sealed by the housing and the lid, and an atmospheric vent valve for introducing atmospheric air into the processing space to cool the resin applied to the workpiece. The housing includes a holding table and a holding table actuator for moving the holding table upwardly and downwardly. The lid includes an upper table disposed opposite the holding table and movable relatively closely to the holding table to spread the resin supplied to the workpiece and coat the workpiece with the resin. When the lid is closed, it covers the opening in the housing to create the hermetically sealed processing space.

Abstract: A method of processing a wafer includes preparing a ring-shaped frame having an opening for accommodating a wafer therein, preparing a wafer having a protrusive ring-shaped stiffener on a reverse side thereof in an outer circumferential excess region thereof, producing a frame unit by affixing a tape to the frame and the reverse side of the wafer, capturing an image of the ring-shaped stiffener and setting a center of an inner circumferential circle of the ring-shaped stiffener on the basis of the captured image, rotating the frame unit around the center of the inner circumferential circle of the ring-shaped stiffener to cut the wafer along the inner circumferential circle of the ring-shaped stiffener, and removing the ring-shaped stiffener severed from the frame unit.

Abstract: A manufacturing method of a resin sheet that is capable of being deformed, covering a front surface of a substrate, and protecting the substrate and that is capable of curing by being given energy from the external includes a liquid resin disposing step of disposing a liquid resin capable of curing by being given the energy from the external on a flat surface and a surface curing step of forming a resin coat layer through curing only an outer circumferential surface of the liquid resin by giving the energy with such intensity that the whole of the liquid resin does not cure to the liquid resin from the external and leaving the liquid resin that is not cured inside the resin coat layer.

Abstract: There is provided a processing method including the steps of measuring a thickness of the wafer, holding the wafer on a holder, supplying a liquid resin to a table that faces the holder, relatively moving the holder and the table closely to each other to coat the wafer with the liquid resin, and hardening the liquid resin that has coated the wafer. In the resin applying step, a distance by which the holder and the table are to be relatively moved closely to each other to coat the wafer with the liquid resin is determined depending on the measured thickness of the wafer.

Abstract: A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

Abstract: A protective member forming apparatus includes an integrating unit that integrates a resin sheet held by a chuck table with a wafer by a resin, a conveying unit that conveys the wafer, and a cutting unit that holds, by a cutting table, the wafer integrated with the resin sheet conveyed by the conveying unit and cuts the resin sheet by a cutting section along the wafer. The cutting unit includes a detection unit that images the wafer by a camera and detects a position of a periphery of the wafer, and a control unit that causes cutting of the resin sheet by the cutting section to be performed only in the case where a peripheral edge of the wafer detected coincides with a track of a cutter blade of the cutting section when the preset resin sheet is cut.

Abstract: A protective component forming apparatus includes a chuck table, a resin supply unit having a pump and a pipe that supply a liquid resin from a tank to a resin sheet held by the chuck table, a pressing unit that presses a workpiece against the liquid resin supplied to the resin sheet held by the chuck table, a curing unit that irradiates the liquid resin pressed by the pressing unit with ultraviolet and cures the liquid resin, a resin inspecting part that senses the viscosity of the liquid resin, and an informing unit.

Abstract: There is provided a sheet used at a time of formation of a protective member protecting one surface of a plate-shaped workpiece by spreading and curing a liquid resin on the one surface. The sheet includes a first layer configured to be brought into contact with a flat specular mounting surface, and a second layer configured to be brought into contact with the liquid resin. The first layer is formed of a material that is easily separated from the mounting surface after adhering to the mounting surface as compared with the second layer, and the second layer is formed of a material having high adhesiveness to the cured resin as compared with the first layer.

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

Abstract: A holding mechanism includes a Bernoulli pad that holds a plate-shaped body, a hand on which the Bernoulli pad is disposed, a sensor that is disposed on the hand and detects that the plate-shaped body is held under suction by the Bernoulli pad, a lateral movement restriction section disposed on the hand, a tube that connects an air source supplying air to the Bernoulli pad and the Bernoulli pad, an adjustment valve that is disposed in the tube and adjusts a flow rate of air supplied to the Bernoulli pad, and a control section that controls operation of the adjustment valve. The control section gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad and, when it is detected by the sensor that the plate-shaped body has been held under suction by the Bernoulli pad, fixes the flow rate of the air.

Abstract: A protective member forming apparatus for forming a protective member on the top surface of a substrate by laminating a liquid resin and a cover sheet on a resin film includes: a liquid resin supply unit configured to supply the liquid resin onto the resin film; a pressing unit including a pressing surface, the pressing unit being configured to spread the liquid resin over the resin film by pressing the liquid resin by the pressing surface via the cover sheet; and a determining unit configured to determine the state of the spread liquid resin. The determining unit includes a determining section configured to determine whether or not the liquid resin is spread over a predetermined range with respect to the substrate.

Abstract: A processing apparatus includes a chuck table having a holding surface for holding a workpiece; a horizontal moving mechanism that moves the chuck table in a horizontal direction and is supplied with a first oil; and a vertical moving mechanism that moves a processing unit in a vertical direction and is supplied with a second oil. Before mounting the workpiece on the holding surface, the holding surface is imaged by a camera while being irradiated with light, and it is examined whether or not the picked-up image is emitting light. If there is a light-emitting part in the picked-up image, it is determined that oil is adhered to the light-emitting part.

Abstract: A resin coating applying apparatus includes a housing, a lid, a lid actuator for actuating the lid openably and closably with respect to the housing, a resin supply for supplying a solid resin to a workpiece, a vacuum pump for evacuating a processing space hermetically sealed by the housing and the lid, and an atmospheric vent valve for introducing atmospheric air into the processing space to cool the resin applied to the workpiece. The housing includes a holding table and a holding table actuator for moving the holding table upwardly and downwardly. The lid includes an upper table disposed opposite the holding table and movable relatively closely to the holding table to spread the resin supplied to the workpiece and coat the workpiece with the resin. When the lid is closed, it covers the opening in the housing to create the hermetically sealed processing space.

Abstract: A protective member forming apparatus for forming a protective member on the top surface of a substrate by laminating a liquid resin and a cover sheet on a resin film includes: a liquid resin supply unit configured to supply the liquid resin onto the resin film; a pressing unit including a pressing surface, the pressing unit being configured to spread the liquid resin over the resin film by pressing the liquid resin by the pressing surface via the cover sheet; and a determining unit configured to determine the state of the spread liquid resin. The determining unit includes a determining section configured to determine whether or not the liquid resin is spread over a predetermined range with respect to the substrate.

Abstract: A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.