Patents by Inventor Yoshikuni Okada
Yoshikuni Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9134346Abstract: A method of making a contact probe including a step of making a first printed wiring board having a signal electrode and a ground electrode used as a contact part of the contact probe with respect to a measuring object, in which the signal electrode and ground electrode are formed of a metal wiring pattern, and making a second printed wiring board with a coaxial line structure having a shield electrode which encloses a signal line and the surroundings of the signal line through an insulating layer. The signal electrode of the first printed wiring board and the signal line of the second printed wiring board are electrically connected together, and the ground electrode of the first printed wiring board and the shield electrode of the second printed wiring board are electrically connected together.Type: GrantFiled: June 24, 2011Date of Patent: September 15, 2015Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KIYOTO MANUFACTURING CO.Inventors: Masahiro Aoyagi, Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shouichi Imai, Shigeo Kiyota
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Publication number: 20110247209Abstract: [Problem] To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. [Means to Solve Problem] It includes a first printed wiring board 3 having a signal electrode 10a and a ground electrode 10b used as a contact part with respect to a measuring object, in which the signal electrode 10a and ground electrode 10b are formed of a metal wiring pattern on a substrate, and a second printed wiring board 2 with a coaxial line structure having shield electrodes 12, 17, 18 which enclose a signal line 15a and the surroundings of the signal line 15a through an insulating layer.Type: ApplicationFiled: June 24, 2011Publication date: October 13, 2011Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KIYOTA MANUFACTURING CO., TSS CORPORATIONInventors: Masahiro Aoyagi, Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shouichi Imai, Shigeo Kiyota
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Patent number: 7990165Abstract: To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. It includes a first printed wiring board 3 having a signal electrode 10a and a ground electrode 10b used as a contact part with respect to a measuring object, in which the signal electrode 10a and ground electrode 10b are formed of a metal wiring pattern on a substrate, and a second printed wiring board 2 with a coaxial line structure having shield electrodes 12, 17, 18 which enclose a signal line 15a and the surroundings of the signal line 15a through an insulating layer.Type: GrantFiled: April 19, 2007Date of Patent: August 2, 2011Assignees: National Institute of Advanced Industrial Science and Technology, Kiyoto Manufacturing Co., TSS CorporationInventors: Masahiro Aoyagi, Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shoichi Imai, Shigeo Kiyota
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Patent number: 7833835Abstract: An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.Type: GrantFiled: August 7, 2007Date of Patent: November 16, 2010Assignee: National Institute of Advanced Industrial Science and TechnologyInventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada
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Patent number: 7767574Abstract: The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate.Type: GrantFiled: March 30, 2007Date of Patent: August 3, 2010Assignees: Kabushiki Kaisha Mikuni Kogyo, National Institute of Advanced Industrial Science and TechnologyInventors: Yoshihiro Gomi, Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Hirotaka Oosato
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Publication number: 20090224781Abstract: [Problem]To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. [Means to Solve Problem] It includes a first printed wiring board 3 having a signal electrode 10a and a ground electrode 10b used as a contact part with respect to a measuring object, in which the signal electrode 10a and ground electrode 10b are formed of a metal wiring pattern on a substrate, and a second printed wiring board 2 with a coaxial line structure having shield electrodes 12, 17, 18 which enclose a signal line 15a and the surroundings of the signal line 15a through an insulating layer.Type: ApplicationFiled: April 19, 2007Publication date: September 10, 2009Applicants: SHINWA FRONTECH CORP., KIYOTA MANUFACTURING CO.Inventors: Masahiro Aoyagi, Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shouichi Imai, Shigeo Kiyota
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Publication number: 20090104766Abstract: The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate.Type: ApplicationFiled: March 30, 2007Publication date: April 23, 2009Inventors: Yoshihiro Gomi, Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Hirotaka Oosato
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Patent number: 7414422Abstract: A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package thType: GrantFiled: April 19, 2005Date of Patent: August 19, 2008Assignees: National Institute of Advanced Industrial Science and Technology, Shinwa Corp. Ltd.Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Hiroyuki Fujita, Kenichi Kobayashi
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Publication number: 20080044950Abstract: An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.Type: ApplicationFiled: August 7, 2007Publication date: February 21, 2008Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCI & TECHInventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada
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Patent number: 7227352Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor la electrically connected to the ground electrode 11a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.Type: GrantFiled: November 21, 2006Date of Patent: June 5, 2007Assignees: National Institute of Advanced Industrial Science and Technology, Kiyota Manufacturing Co.Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota
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Patent number: 7208966Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor 1a electrically connected to the ground electrode 1a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.Type: GrantFiled: May 25, 2005Date of Patent: April 24, 2007Assignees: National Institute of Advanced Industrial Science and Technology, Kiyota Manufacturing Co.Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota
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Publication number: 20070065956Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor la electrically connected to the ground electrode 11a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.Type: ApplicationFiled: November 21, 2006Publication date: March 22, 2007Applicants: NAT'L INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KIYOTA MANUFACTURING CO.Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota
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Publication number: 20050264313Abstract: There is provided a contact probe that is smaller than 50 ?m in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor 1a electrically connected to the ground electrode 1a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.Type: ApplicationFiled: May 25, 2005Publication date: December 1, 2005Applicants: National Institute of Advanced Industrial Science and Technology, KIYOTA MANUFACTURING CO.Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota
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Publication number: 20050236717Abstract: A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package thType: ApplicationFiled: April 19, 2005Publication date: October 27, 2005Applicants: National Institute of Advanced Industrial Science and Technology, Shinwa Corp. Ltd.Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Hiroyuki Fujita, Kenichi Kobayashi
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Publication number: 20040256727Abstract: An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.Type: ApplicationFiled: June 18, 2004Publication date: December 23, 2004Inventors: Masahiro Aoyagi, Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada