Abstract: As an arrangement to reduce an operational force to draw the drawer 3 forward from the drawer storage position 2, wherein at least a rear end side of a drawer 3 is supported in a drawer storage portion 2 in a manner movable along back and forth and a front end 3b side thereof is supported in a manner movable along back and forth by a floor F at least through a rolling supporting body, the rolling supporting body adopts a free motion rotating body 12 whose upper end 12b makes an abutting contact with a downward facing surface 3a of the drawer 3 and whose bottom end 12a contacts the floor F and the free motion rotating body 12 supports the front end 3b side of the drawer 3 with making a rolling movement at a half traveling speed of the drawer 3.

Abstract: A top surface of a LSI chip having a structure of a bare chip is provided with bumps, and a protective resin is provided for at least side surfaces of the LSI chips. The LSI chip is prevented from being chipped off or cracked because of protective resin provided for the side surfaces of the LSI chip. The invention provides a semiconductor device and a method for fabricating the same, in which the chip or a package thereof is prevented from being damaged, and thereby yield rate of the semiconductor device can be heightened. Since the numbers of the parts of the semiconductor device and the steps of using jigs and tools necessary for the fabrication process are reduced, fabricating cost of the semiconductor device can be cut down.

Abstract: A top surface of a LSI chip having a structure of a bare chip is provided with bumps, and a protective resin is provided for at least side surfaces of the LSI chips. The LSI chip is prevented from being chipped off or cracked because of protective resin provided for the side surfaces of the LSI chip. The invention provides a semiconductor device and a method for fabricating the same, in which the chip or a package thereof is prevented from being damaged, and thereby yield rate of the semiconductor device can be heightened. Since the numbers of the parts of the semiconductor device and the steps of using jigs and tools necessary for the fabrication process are reduced, fabricating cost of the semiconductor device can be cut down.

Abstract: The device of the invention comprises an adjuster 6 having a supporting end 6a in contact with a floor F to support a foldable table 1 in restrained condition, a caster 7 movable between a retracted position A where the supporting end 7a thereof at least contacts the floor F simultaneously with the supporting end 6a of the adjuster 6 and a projecting position B where the supporting end 7a projects toward the floor F beyond the supporting end 6a of the adjuster 6, and an urging mechanism 80 for urging the caster 7 toward the floor F with a force greater than the gravity acting on the foldable table 1 when the caster 7 is at or adjacent the projecting position and with a force smaller than the gravity acting on the foldable table 1 when the caster 7 is at or adjacent the retracted position.