Abstract: This invention provides:(i) an acitve energy beam-curable composition for coating the surface of optical fibers therewith, the composition comprising about 100 parts by weight of an active energy beam-curable substance, about 0.5 to about 100 parts by weight of a particulate substance having a mean particle size of about 0.2 to about 200 .mu.m and optionally a photopolymerization initiator;(ii) a coated optical fiber prepared by applying the composition of item (i) to the surface of an optical fiber and curing the coating;(iii) a bundle-type optical fiber cable prepared using the coated optical fiber of item (ii);(iv) an optical fiber unit of the tape type prepared by applying the composition of item (i) to optical fibers and curing the coating; and(v) an optical fiber prepared using the optical fiber unit of item (iv).

Abstract: Disclosed is a curable composition consisting essentially of (i) a polymerizable double bond-containing resin prepared by introducing a polymerizable double bond-containing group into a polymer containing as a monomer a fluoroalkyl acrylate or methacrylate represented by the formulaCH.sub.2 .dbd.C(R)--COO(CX.sub.2).sub.m (CF.sub.2).sub.n X (I)wherein R is methyl or hydrogen, X is fluorine or hydrogen, m is 1 or 2 and n is an integer of 1 to 12, and (ii) a fluoroalkyl acrylate or methacrylate of the formula (I).

Abstract: Disclosed is a process for preparing a printed-circuit board, which process comprises the steps of:(a) subjecting a copper plated laminated, insulative plate for use in a printed circuit and having through-holes to electrodeposition coating in a photo-curable electrodeposition coating composition bath to form a resist film on the surface of a copper foil of the copper plated laminated insulative plate;(b) lapping a wiring pattern mask on the resist film so that a through-hole wall area may form an exposed area;(c) exposing the resist film to ultraviolet light through the lapped wiring pattern mask;(d) removing the wiring pattern mask from the resist film;(e) exposing the resist film in the through-hole wall area to ultraviolet light through an optical fiber;(f) removing the resist film not exposed under the wiring pattern mask;(g) etching away the exposed copper foil; and(h) removing the etching resist pattern film.

Abstract: Disclosed is a curable composition consisting essentially of (i) a polymerizable double bond-containing resin prepared by introducing a polymerizable double bond-containing group into a polymer containing as a monomer a fluoroalkyl acrylate or methacrylate represented by the formulaCH.sub.2 .dbd.C(R)--COO(CX.sub.2).sub.m (CF.sub.2).sub.n X (I)wherein R is methyl or hydrogen, X is fluorine or hydrogen, m is 1 or 2 and n is an integer of 1 to 12, and (ii) a fluoroalkyl acrylate or methacrylate of the formula (I).