Patents by Inventor Yoshimasa Miyajima
Yoshimasa Miyajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8128768Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: September 16, 2010Date of Patent: March 6, 2012Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20110011514Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: September 16, 2010Publication date: January 20, 2011Applicant: FUJITSU LIMITEDInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7819165Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: October 26, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7703494Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: April 27, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7681522Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: March 23, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7621310Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: November 24, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7513966Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: April 7, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7476283Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: January 13, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7354494Abstract: An apparatus for manufacturing a laminated substrate with a simple structure and with satisfactory yield. First and second holding plates each attract substrates without contacting a laminating surface of the two substrates. A substrate conveying device conveys the substrates into the processing chamber. The substrate conveying device attracts only the surface of a substrate that is opposite to the laminating surface, transfers the substrate to a holding plate, and receives the substrate from the holding plate.Type: GrantFiled: September 8, 2004Date of Patent: April 8, 2008Assignee: Fujitsu LimitedInventors: Yoshimasa Miyajima, Ariyoshi Shibata, Joji Hasegawa, Tetsuji Kadowaki
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Patent number: 7300532Abstract: A method for bonding a first substrate with a second substrate in a treatment chamber, wherein the treatment chamber accommodates a first holding unit that attracts the first substrate and a second holding unit that attracts the second substrate.Type: GrantFiled: October 12, 2005Date of Patent: November 27, 2007Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201628Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201617Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201603Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201424Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201629Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201627Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7096911Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: November 30, 2001Date of Patent: August 29, 2006Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060157192Abstract: A laminated substrate manufacturing device for eliminating deformation of substrates during a period between when the substrates undergo a conveying process and an attracting process before the substrates are laminated. The laminated substrate manufacturing device includes two holding plates arranged in a processing chamber. Each holding plate includes vacuum pads for attracting a corresponding substrate. A controller controls an attraction device provided for each holding plate so that the holding plate sequentially attracts the corresponding substrate from a central portion to the peripheral portion of the substrate.Type: ApplicationFiled: June 7, 2005Publication date: July 20, 2006Applicant: FUJITSU LIMITEDInventors: Joji Hasegawa, Yoshimasa Miyajima, Takanori Muramoto
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Publication number: 20060027318Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: October 12, 2005Publication date: February 9, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060005920Abstract: A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.Type: ApplicationFiled: September 13, 2005Publication date: January 12, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima