Patents by Inventor Yoshimasa Oyama

Yoshimasa Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4822560
    Abstract: A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.
    Type: Grant
    Filed: October 8, 1986
    Date of Patent: April 18, 1989
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yoshimasa Oyama, Masato Asai, Toru Tanigawa, Shigeo Shinozaki, Shoji Shiga
  • Patent number: 4741394
    Abstract: In a radiator for motor cars wherein fins are fitted between vertical tubes through which the heat-exchanging medium flows to form a core and tube plates are provided at both ends of the tubes of said core to connect with a resinous tank, a concave groove is formed outside the peripheral portion thereof, and an elastic seal member is provided in said concave groove to insert the open end of the resinous tank, the improvement wherein said tube plates are .alpha. brass containing 15-38 wt. % Zn, 0.05-1.5 wt. % Si, and the remainder Cu.
    Type: Grant
    Filed: August 11, 1986
    Date of Patent: May 3, 1988
    Assignees: The Furukawa Electric Co., Ltd., Nippondenso Co., Ltd.
    Inventors: Toru Tanigawa, Shoji Shiga, Kiichi Akasaka, Yoshimasa Oyama
  • Patent number: 4732731
    Abstract: A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.
    Type: Grant
    Filed: August 26, 1986
    Date of Patent: March 22, 1988
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Makoto Asai, Shoji Shiga, Toru Tanigawa, Yoshimasa Oyama, Shigeo Shinozaki