Abstract: An RFID tag includes a circuit board and a plurality of functional modules. The circuit board has an antenna conductor and a ground plane. On the circuit board, a control circuit and an RFID IC are mounted. The functional modules are connected to the circuit board. The circuit board includes a main part and an extended part. The main part includes a mounting plane for the control circuit and the ground plane. The extended part includes the antenna conductor and is integrated with the main part. The extended part and the antenna conductor are longer than one edge of the main part and disposed along the one edge.

Abstract: An RFID tag includes a circuit board, an RFID IC, a functional module, a case and a lid. The circuit board has a main part and an extended part. The extended part extends along an edge of the main part and includes an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is disposed so as to overlap the circuit board. The case accommodates the circuit board and the functional module. The lid closes an opening of the case. The main part of the circuit board is held at a position away from an inner bottom surface of the case with the functional module as an obstacle in a direction toward the lid.

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.

Abstract: An RFID tag includes a circuit board, an RFID IC, a functional module, a case and a lid. The circuit board has a main part and an extended part. The extended part extends along an edge of the main part and includes an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is disposed so as to overlap the circuit board. The case accommodates the circuit board and the functional module. The lid closes an opening of the case. The main part of the circuit board is held at a position away from an inner bottom surface of the case with the functional module as an obstacle in a direction toward the lid.

Abstract: An RFID tag includes a circuit board and a plurality of functional modules. The circuit board has an antenna conductor and a ground plane. On the circuit board, a control circuit and an RFID IC are mounted. The functional modules are connected to the circuit board. The circuit board includes a main part and an extended part. The main part includes a mounting plane for the control circuit and the ground plane. The extended part includes the antenna conductor and is integrated with the main part. The extended part and the antenna conductor are longer than one edge of the main part and disposed along the one edge.

Abstract: An RFID tag board includes a circuit board and a radiation member. The circuit board includes a dielectric substrate, a radiation conductor, a ground conductor, a connection conductor, a first electrode and a second electrode. The dielectric substrate includes a first surface, a second surface and a recess. The second surface is opposite to the first surface, and is a mounting surface to be mounted on an article. The radiation conductor is on the first surface of the dielectric substrate. The ground conductor is on the second surface of the dielectric substrate. The connection conductor electrically connects the radiation conductor and the ground conductor. The first electrode and the second electrode are in the recess. The radiation member is fixed to the first surface of the circuit board.

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.

Abstract: A tag board includes an insulation substrate with a lower surface bonded to the outside and an upper surface including a recess, an upper surface conductor on the upper surface of the insulation substrate, a ground conductor on the lower surface of the insulation substrate, and a short-circuit-portion through conductor that penetrates the insulation substrate in the thickness direction and electrically connects the upper surface conductor and the ground conductor to each other. The short-circuit-portion through conductor is connected to the upper surface conductor only at a part of the periphery of the upper surface conductor.

Abstract: An RFID tag board includes a circuit board and a radiation member. The circuit board includes a dielectric substrate, a radiation conductor, a ground conductor, a connection conductor, a first electrode and a second electrode. The dielectric substrate includes a first surface, a second surface and a recess. The second surface is opposite to the first surface, and is a mounting surface to be mounted on an article. The radiation conductor is on the first surface of the dielectric substrate. The ground conductor is on the second surface of the dielectric substrate. The connection conductor electrically connects the radiation conductor and the ground conductor. The first electrode and the second electrode are in the recess. The radiation member is fixed to the first surface of the circuit board.

Abstract: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.

Abstract: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.

Abstract: An RFID tag board includes an insulating substrate with an upper surface and a lower surface with a recess, an upper surface conductor on the upper surface of the insulating substrate, a ground conductor on the lower surface of the insulating substrate, the ground conductor being electrically connected to the upper surface conductor by a short-circuit portion through conductor penetrating the insulating substrate in a thickness direction, a capacitance conductor in the insulating substrate, the capacitance conductor facing a portion of the upper surface conductor, a capacitance portion through conductor penetrating the insulating substrate in the thickness direction from the capacitance conductor to the ground conductor, and a first electrode and a second electrode in the recess, the first electrode electrically connected to the capacitance conductor or the ground conductor by a first connection conductor, the second electrode electrically connected to the upper surface conductor via a second connection condu

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.

Abstract: A sensor substrate includes a substrate comprising an upper surface including a first mounting area on which a light-emitting element is mounted, and a lower surface including a second mounting area on which a light-receiving element is mounted. The substrate is further provided with a through hole therethrough extending from a portion of the upper surface which portion is adjacent to the first mounting area, to the second mounting area of the lower surface. An inner surface of the through hole is provided with at least one protrusion (a first protrusion and a second protrusion) extending inwardly within the through hole.

Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.

Abstract: An RFID tag board includes an insulating substrate with an upper surface and a lower surface with a recess, an upper surface conductor on the upper surface of the insulating substrate, a ground conductor on the lower surface of the insulating substrate, the ground conductor being electrically connected to the upper surface conductor by a short-circuit portion through conductor penetrating the insulating substrate in a thickness direction, a capacitance conductor in the insulating substrate, the capacitance conductor facing a portion of the upper surface conductor, a capacitance portion through conductor penetrating the insulating substrate in the thickness direction from the capacitance conductor to the ground conductor, and a first electrode and a second electrode in the recess, the first electrode electrically connected to the capacitance conductor or the ground conductor by a first connection conductor, the second electrode electrically connected to the upper surface conductor via a second connection condu

Abstract: A tag board includes an insulation substrate with a lower surface bonded to the outside and an upper surface including a recess, an upper surface conductor on the upper surface of the insulation substrate, a ground conductor on the lower surface of the insulation substrate, and a short-circuit-portion through conductor that penetrates the insulation substrate in the thickness direction and electrically connects the upper surface conductor and the ground conductor to each other. The short-circuit-portion through conductor is connected to the upper surface conductor only at a part of the periphery of the upper surface conductor.

Abstract: Aspects of the invention relate to creating virtual data of an effective obligor number N based on setting information, determining ratings after transition of the virtual data for a plurality of scenarios according to rating transition data representing transition of each rating, calculating a risk amount for each of the scenarios based on the rating after transition of the virtual data and specifying a risk amount corresponding to a confidence level as a predicted risk amount of the virtual data, setting a minimum effective obligor number N among the effective obligor numbers N when predicted risk amounts smaller than an allowable risk amount are specified, as a diversification object number, and calculating a credit limit based on the set diversification object number and a total credit.

Abstract: A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furthermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.

Abstract: Aspects of the invention relate to creating virtual data of an effective obligor number N based on setting information, determining ratings after transition of the virtual data for a plurality of scenarios according to rating transition data representing transition of each rating, calculating a risk amount for each of the scenarios based on the rating after transition of the virtual data and specifying a risk amount corresponding to a confidence level as a predicted risk amount of the virtual data, setting a minimum effective obligor number N among the effective obligor numbers N when predicted risk amounts smaller than an allowable risk amount are specified, as a diversification object number, and calculating a credit limit based on the set diversification object number and a total credit.