Abstract: An inductor component capable of improving an inductance value includes an element body that includes a magnetic layer and has a first principal surface and a second principal surface opposite to each other; a coil in the element body; and an insulation layer that covers a part of an outer surface of the coil. The coil has a first inductor wire wound along a plane orthogonal to a first direction which is orthogonal to the first principal surface and is from the second principal surface toward the first principal surface. At least a part of an inner peripheral surface of an innermost periphery of the first inductor wire is in contact with the magnetic layer without being covered with the insulation layer.

Abstract: A passive component includes an inorganic substrate having a first main surface and a second main surface, which are opposed to each other, and contains a semiconductor material; and a passive element portion on the first main surface of the inorganic substrate so as to be in contact with the first main surface. When a cross section in a plane that passes through a center of gravity in a whole of the first main surface and is orthogonal to the first main surface is defined as a first cross section, in the first cross section, the inorganic substrate has a first side surface and a second side surface, which are connected with the first main surface and opposed to each other, and each of line roughness of the first side surface and line roughness of the second side surface is larger than line roughness of the first main surface.

Abstract: An inductor component includes an element body. The element body includes an inductor wire extending parallel to a first principal surface of the element body, columnar wires extending in a direction intersecting the first principal surface, and outer electrodes. Each inductor wire has a wire body, a first end pad connected to a first end of the wire body, and a second end pad connected to a second end of the wire body. The first and second end pads each have a large wire width relative to the wire body. The inductor wires include first and second inductor wires. When viewed transparently in a direction orthogonal to the first principal surface, at least one of a size and shape of the second end pad of the first inductor wire differs from at least one of a size and shape of the second end pad of the second inductor wire.

Abstract: An inductor component includes an element body. The element body includes an inductor wire extending parallel to a first principal surface of the element body, a plurality of columnar wires extending in a direction intersecting the first principal surface, and a plurality of outer electrodes exposed from the first principal surface. When viewed transparently in a direction orthogonal to the first principal surface, a first vector extending from a geometric center of at least one selected from a plurality of first-end columnar wires toward a geometric center of a first outer electrode connected to the first columnar wire is different from a second vector extending from a geometric center of at least one selected from a plurality of second-end columnar wires toward a geometric center of a second outer electrode connected to the second columnar wire.

Abstract: An inductor component includes an element body, a plurality of inductor wires, a plurality of columnar wires, and outer electrodes. The element body has a first principal surface. An axis parallel to the first principal surface is a first axis. Each inductor wire has a wire body, a first end pad connected to a first end of the wire body and having a large wire width relative to the wire body, and a second end pad connected to a second end of the wire body and having a large wire width relative to the wire body. Geometric centers of the first end pads of the inductor wires are on a single line that is parallel to the first axis. At least one of geometric centers of the second end pads of the inductor wires is not on a single line that is parallel to the first axis.

Abstract: An inductor component includes an element body, an inductor wire, and a plurality of columnar wires. The element body has a first principal surface. The inductor wire extends parallel to the first principal surface within the element body. Each columnar wire is connected to an end of the inductor wire and extends in a direction orthogonal to the first principal surface. The plurality of columnar wires are exposed from the element body at the first principal surface. A minimum distance from the first principal surface to the inductor wire is larger than or equal to 0.04 mm.

Abstract: An inductor component includes an element body, a plurality of inductor wires, a plurality of columnar wires, and a plurality of outer electrodes. The plurality of inductor wires include a first inductor wire and a second inductor wire. The plurality of columnar wires include a plurality of first columnar wires and a plurality of second columnar wires. The plurality of outer electrodes include a plurality of first outer electrodes connected to the first columnar wires and a plurality of second outer electrodes connected to the second columnar wires. When viewed transparently in a direction orthogonal to a first principal surface, the first inductor wire has a portion overlapping the second outer electrodes.

Abstract: An inductor component comprising a main body part including a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the main body part; an external terminal exposed from the main body part; and a lead-out wiring electrically connecting the inductor wiring and the external terminal. Also, an outer surface of the external terminal includes a concave part.

Abstract: In an inductor component, an inductor wire is in an element body and extends on a virtual flat plane passing inside the element body. A wire main body of the inductor wire has an oblong rectangular shape elongated in a length direction in the top view, and thus, a wire width perpendicular to the extending direction is constant. From each edge of the wire main body in a width direction, protrusions having an oblong rectangular shape in the top view protrude and extend, from a center of the wire main body in the extending direction of the wire main body, in a direction perpendicular to the extending direction, on both sides in the width direction of the wire main body, with the extending direction sandwiched between the protrusions. An area ratio of a protrusion area of the protrusions to an area of the wire main body is within 7.2%.

Abstract: In an inductor component, a first magnetic layer thickness of the first magnetic layer as a measurement in the normal direction is smaller than a second magnetic layer thickness of the second magnetic layer as a measurement in the normal direction. An inductor wiring thickness of the inductor wiring as a measurement in the normal direction is from larger than 0.5 times a vertical wiring thickness of the vertical wiring as a measurement in the normal direction to smaller than 1.5 times the vertical wiring thickness.

Abstract: An electronic component includes a capacitor element, an inductor element connected electrically to the capacitor element, and an interlayer-insulation layer between the capacitor and inductor elements. The interlayer-insulation layer has a first principal surface, a second principal surface, and a via hole through the interlayer-insulation layer between the first and second principal surfaces. The capacitor element is at a side of the second principal surface of the interlayer-insulation layer and includes a first electrode layer, a second electrode layer, and a dielectric layer interposed between the first electrode layer and the second electrode layer. The inductor element is at a side of the first principal surface of the interlayer-insulation layer and includes an inductor wire that has an inductor portion disposed on the first principal surface and also has a via portion through the via hole to connect the inductor portion to the second electrode layer.

Abstract: A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.

Abstract: An inductor array component including an element body and a first straight wiring line and a second straight wiring line that are arranged on the same plane inside the element body. The element body includes a first region that is located on a first side of the first straight wiring line or the second straight wiring line in a normal direction that is normal to the plane, a second region that is located on a second side of the first straight wiring line or the second straight wiring line in the normal direction that is normal to the plane, and a third region that is located between the first straight wiring line and the second straight wiring line. The greater one out of the magnetoresistance of the first region and the magnetoresistance of the second region is greater than or equal to the magnetoresistance of the third region.

Abstract: An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 ?m, the wire pitch of the spiral wires is equal to or smaller than 10 ?m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 ?m.

Abstract: An electronic component capable of improving connection reliability between a via conductor and a circuit pattern. An electronic component includes a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor provided inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor. The via conductor and the wiring member are integrally formed, and in the via conductor, a diameter of an end portion on a side close to the circuit pattern is larger than a diameter of an end portion on a side close to the wiring member.

Abstract: An inductor array component includes a substantially flat plate-shaped main body including a magnetic layer having resin and metal magnetic powder contained in the resin, a first inductor wiring and a second inductor wiring disposed on the same plane in the main body and adjacent to each other, and a plurality of first vertical wirings extending in a first direction of a normal direction with respect to the plane so as to penetrate through inside of the main body and being exposed on a side of a first main surface of the main body. Also, the inductor array component includes a plurality of second vertical wirings extending in a second direction of the normal direction with respect to the plane so as to penetrate through the inside of the main body and being exposed on a side of a second main surface of the main body.

Abstract: In an electronic component including a circuit pattern embedded in an insulating layer, connection reliability between the circuit pattern and a wiring conductor outside the insulating layer is improved. An electronic component includes an insulating layer; a circuit pattern embedded in the insulating layer; a wiring conductor formed outside the insulating layer; and an interlayer connection portion that connects a circuit connection portion, which is a part of the circuit pattern, and the wiring conductor with an opening of the insulating layer interposed therebetween. In the circuit pattern, a thickness of a portion immediately below the interlayer connection portion of the circuit connection portion is larger than an average thickness of a portion other than the circuit connection portion.

Abstract: A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.

Abstract: An inductor component including a magnetic layer in which a magnetic metal powder is dispersedly present in a base material made of an insulation material and an inductor wiring line laminated on a surface of the magnetic layer. The inductor wiring line includes an anchor portion extending from a main face of the inductor wiring line on a side of the magnetic layer and covering a surface of the magnetic metal powder in the magnetic layer.

Abstract: A stacked semiconductor package includes a first substrate; a three-dimensional device stacked in a first direction with respect to the first substrate; and a first connection member for connecting the first substrate to the three-dimensional device. The three-dimensional device includes components, each of which includes a semiconductor integrated circuit component and a passive component stacked in the first direction. A first major surface, which faces the three-dimensional device, of the first substrate and a first major surface, which faces the first substrate, of the three-dimensional device are connected to each other with the first connection member interposed therebetween while being separated from each other. A first major surface, which faces the passive component, of the semiconductor integrated circuit component and a first major surface, which faces the semiconductor integrated circuit component, of the passive component each include a flat surface.