Patents by Inventor Yoshimi Inagawa

Yoshimi Inagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bi—Sn based high-temperature solder alloy
    Patent number: 9205513
    Abstract: A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: December 8, 2015
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Minoru Ueshima, Yoshimi Inagawa, Minoru Toyoda
  • Bi-Sn Based High-Temperature Solder Alloy
    Publication number: 20130121874
    Abstract: A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.
    Type: Application
    Filed: June 17, 2011
    Publication date: May 16, 2013
    Inventors: Minoru Ueshima, Yoshimi Inagawa, Minoru Toyoda