Abstract: A whisker of molybdenum oxide in the form of a filament, rod or flake. Molybdenum oxide whiskers are produced by firing metallic molybdenum at a temperature of at least 400.degree. C., preferably at least 800.degree. C., in an atmosphere containing oxygen, or by firing an organic molybdenum compound in an atmosphere containing oxygen at a temperature which is at least equal to its thermal decomposition temperature. They are very strong crystals which are expected to be useful as a filler for plastics and for a variety of other applications.

Abstract: Disclosed is a thermal head in which a heat-generating resistor layer, a power feeding conductor layer, and a protecting film are formed on an electrically insulating substrate, the heat generating resistor layer being constituted by an alloy of tantalum, rare earth metals, and nitrogen.Further disclosed is a method of producing a thermal head comprising the steps of forming a heat-generating resistor layer, a power feeding conductor layer, and a protecting film, on an electrically insulating substrate, the step of forming the heat-generating resistor layer including the step of performing spattering in mixed gases of argon and nitride to form the heat-generating resistor layer made of an alloy of tantalum, a rare earth metal material, and nitrogen, by using a composite target in which small pieces of the rare earth metal materials are disposed on a tantalum target.

Abstract: A whisker of molybdenum oxide in the form of a filament, rod or flake. Molybdenum oxide whiskers are produced by firing metallic molybdenum at a temperature of at least 400.degree. C., preferably at least 800.degree. C., in an atmosphere containing oxygen, or by firing an organic molybdenum compound in an atmosphere containing oxygen at a temperature which is at least equal to its thermal decomposition temperature. They are very strong crystals which are expected to be useful as a filler for plastics and for a variety of other applications.

Abstract: Whiskers comprising needle- or rod-shaped single crystals of tellurium oxide. They are produced by firing metallic tellurium at a temperature of at least 400.degree. C. in an atmosphere containing oxygen.

Abstract: An elastic surface wave element which has a grille-shaped electrode formed on a piezoelectric substrate is improved by having the grille-shaped electrode portion thereof covered with an insulating film made of tantalum pentoxide or silicon nitride. The insulating film functions to minimize the degradation of properties suffered by the conventional elastic surface wave element and preclude substantially completely the phenomenon of short-circuit between the electrode bars of the grille-shaped electrode.

Abstract: Disclosed is a paste for formation of a transparent electroconductive coating film, which comprises as a main component an organic indium complex having an oxygen atom coordinated directly to the indium atom, which is capable of forming an indium oxide film by sintering, such as trisacetylacetonatoindium (III).This paste provides a coating film having a low resistivity and a high transparency by screen printing and sintering, and has a good stability and a long pot life.If an organic tin compound such as tin octylate, dibutyl tin dilaurate or tetraacetylacetonatotin is incorporated as a resistivity-adjusting agent into this paste in an amount such that the Sn/(In+Sn) atomic ratio is 2 to 20%, especially good results are obtained. A cellulose derivative such as ethyl cellulose, nitrocellulose, acetyl cellulose or benzyl cellulose is advantageously incorporated as a viscosity builder into the paste.

Abstract: A paste for forming a transparent conductive coating film which is composed of an indium compound as a principal ingredient, a tin compound for resistance adjustment, nitrocellulose as a thickener, and a mixed solvent of butyl cellosolve, butyl carbitol, benzyl acetate, and dimethyl phthalate. This paste has a long life and improved workability in screen printing and provides a coating film superior in transparency and bond strength.