Patents by Inventor Yoshimi Murage

Yoshimi Murage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Patent number: 8409756
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: April 2, 2013
    Assignee: Air Water Inc.
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Patent number: 8411415
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: April 2, 2013
    Assignee: Air Water Inc.
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquid
    Patent number: 8362187
    Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: January 29, 2013
    Assignee: Air Water Inc.
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Patent number: 8293860
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: October 23, 2012
    Assignee: Air Water Inc.
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • NON-THERMOFUSIBLE PHENOL RESIN POWDER, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR
    Publication number: 20120237830
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 20, 2012
    Inventors: Naoto YOSHINAGA, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • NON-THERMOFUSIBLE PHENOL RESIN POWDER, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR
    Publication number: 20120135238
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: February 2, 2012
    Publication date: May 31, 2012
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Patent number: 8158095
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: April 17, 2012
    Assignee: Air Water Inc.
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Phenol Resin Powder, Method For Producing The Same, And Phenol Resin Powder Dispersion Liquid
    Publication number: 20100086782
    Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.
    Type: Application
    Filed: October 12, 2007
    Publication date: April 8, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Publication number: 20100074831
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: September 4, 2009
    Publication date: March 25, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Publication number: 20100075228
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: September 4, 2009
    Publication date: March 25, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
    Publication number: 20100004356
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: October 12, 2007
    Publication date: January 7, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda