Patents by Inventor Yoshimi Terui

Yoshimi Terui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatuses and methods for coupling contact pads to a circuit in a semiconductor device
    Patent number: 10847433
    Abstract: Apparatuses and methods for coupling contact pads to a circuit in a semiconductor device is described. An example apparatus includes a first pad, a first wiring coupled to the first pad, a second pad, a second wiring, a circuit coupled to the second pad, and a switch circuit. The switch circuit includes first, second, and third connections, and includes first and second control gates. The first wiring is coupled to the first and third connections and second wiring is coupled to the second connection. The switch circuit is configured to couple the first wiring with the second wiring when the first and second control gates are activated and to decouple the first wiring from the second wiring when the first and second control gates are not activated.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: November 24, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Masahiko Igeta, Yoshimi Terui
  • APPARATUSES AND METHODS FOR COUPLING CONTACT PADS TO A CIRCUIT IN A SEMICONDUCTOR DEVICE
    Publication number: 20190333830
    Abstract: Apparatuses and methods for coupling contact pads to a circuit in a semiconductor device is described. An example apparatus includes a first pad, a first wiring coupled to the first pad, a second pad, a second wiring, a circuit coupled to the second pad, and a switch circuit. The switch circuit includes first, second, and third connections, and includes first and second control gates. The first wiring is coupled to the first and third connections and second wiring is coupled to the second connection. The switch circuit is configured to couple the first wiring with the second wiring when the first and second control gates are activated and to decouple the first wiring from the second wiring when the first and second control gates are not activated.
    Type: Application
    Filed: July 10, 2019
    Publication date: October 31, 2019
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Masahiko Igeta, Yoshimi Terui
  • APPARATUSES AND METHODS FOR COUPLING CONTACT PADS TO A CIRCUIT IN A SEMICONDUCTOR DEVICE
    Publication number: 20190304855
    Abstract: Apparatuses and methods for coupling contact pads to a circuit in a semiconductor device is described. An example apparatus includes a first pad, a first wiring coupled to the first pad, a second pad, a second wiring, a circuit coupled to the second pad, and a switch circuit. The switch circuit includes first, second, and third connections, and includes first and second control gates. The first wiring is coupled to the first and third connections and second wiring is coupled to the second connection. The switch circuit is configured to couple the first wiring with the second wiring when the first and second control gates are activated and to decouple the first wiring from the second wiring when the first and second control gates are not activated.
    Type: Application
    Filed: April 3, 2018
    Publication date: October 3, 2019
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Masahiko Igeta, Yoshimi Terui
  • Apparatuses and methods for coupling contact pads to a circuit in a semiconductor device
    Patent number: 10410938
    Abstract: Apparatuses and methods for coupling contact pads to a circuit in a semiconductor device is described. An example apparatus includes a first pad, a first wiring coupled to the first pad, a second pad, a second wiring, a circuit coupled to the second pad, and a switch circuit. The switch circuit includes first, second, and third connections, and includes first and second control gates. The first wiring is coupled to the first and third connections and second wiring is coupled to the second connection. The switch circuit is configured to couple the first wiring with the second wiring when the first and second control gates are activated and to decouple the first wiring from the second wiring when the first and second control gates are not activated.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: September 10, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Masahiko Igeta, Yoshimi Terui
  • Semiconductor device having signal line and power supply line intersecting with each other
    Patent number: 9379053
    Abstract: Disclosed herein is a semiconductor device includes: a plurality of first power supply wirings provided on a first wiring layer and extending in a first direction; a plurality of second power supply wirings provided on a second wiring layer different from the first wiring layer and extending in a second direction intersecting the first direction; a signal wiring provided on the second wiring layer and extending in the second direction; and a plurality of through-hole conductors each electrically connecting an associated one of the first power supply wirings to an associated one of the second power supply wirings. At least a part of the first power supply wirings have a notch in a portion intersecting the signal wiring.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: June 28, 2016
    Assignee: PS4 Luxco S.a.r.l.
    Inventors: Yoshimi Terui, Kazuhiko Matsuki
  • SEMICONDUCTOR DEVICE HAVING SIGNAL LINE AND POWER SUPPLY LINE INTERSECTING WITH EACH OTHER
    Publication number: 20130228935
    Abstract: Disclosed herein is a semiconductor device includes: a plurality of first power supply wirings provided on a first wiring layer and extending in a first direction; a plurality of second power supply wirings provided on a second wiring layer different from the first wiring layer and extending in a second direction intersecting the first direction; a signal wiring provided on the second wiring layer and extending in the second direction; and a plurality of through-hole conductors each electrically connecting an associated one of the first power supply wirings to an associated one of the second power supply wirings. At least a part of the first power supply wirings have a notch in a portion intersecting the signal wiring.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 5, 2013
    Applicant: Elpida Memory, Inc.
    Inventors: Yoshimi Terui, Kazuhiko Matsuki