Abstract: A substrate includes fine lines. The fine lines are obtained according to a fine-line forming process, which includes a process of projecting light from above the substrate onto predetermined regions on a photosensitive material provided on the substrate and a developing process after the light projection process. A narrow-width portion is provided at an end portion of each of the fine lines in a longitudinal direction of the fine line. The width of the narrow-width portion is smaller than the width of a portion adjacent to the narrow-width portion.

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 &mgr;m. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Abstract: A method of manufacturing wiring includes a step of forming a conductive layer pattern through a developing step after performing film formation and exposure step using photosensitive paste that contains a photosensitive material and a conductive material, a step of forming an insulating layer pattern through a developing step after performing film formation and exposure step using photosensitive paste that contains a photosensitive material and an insulating material, and a baking step for baking the conductive layer pattern and the insulating layer pattern. Thus, a wiring pattern can be formed with high precision by reducing an edge curl.

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 &mgr;m. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Abstract: A method for forming patterned insulating elements on a substrate includes a plurality of exposure steps of exposing a photosensitive paste provided on the substrate through at least one mask having a predetermined pattern; a developing step of developing the exposed photosensitive paste to form a precursor pattern; and a firing step of firing the precursor pattern to form the patterned insulating elements. This method is applied to a method for forming an electron source and a method for forming an image display device including the electron source.

Abstract: In an electron source having an electron emitting member, the electron emitting member is connected to a first or second conductive member by a third conductive member which is connected to the first or second conductive member through an aperture forming in an insulating member, and such aperture has such a shape as to become narrower from an end of the third conductive member toward the other end. Such configuration avoids that the third conductive member is damaged in the connecting portion with the first or second conductive member by the thermal stress therein.

Abstract: A method of manufacturing wiring includes a step of forming a conductive layer pattern through a developing step after performing film formation and exposure step using photosensitive paste that contains a photosensitive material and a conductive material, a step of forming an insulating layer pattern through a developing step after performing film formation and exposure step using photosensitive paste that contains a photosensitive material and an insulating material, and a baking step for baking the conductive layer pattern and the insulating layer pattern. Thus, a wiring pattern can be formed with high precision by reducing an edge curl.

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 &mgr;m. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

Abstract: The wirings on an electron source substrate are formed to intersect with each other in a matrix so as to address the electron emission devices on the substrate. First and second wirings intersect with each other on a crossing point. As such a crossing point, an insulating layer is placed between the first and second wirings. To ensure insulation, a plurality of insulating layers are laminated. According to the present invention, a wiring pattern is provided on the substrate with a conductive paste and baking the wiring pattern of the conductive paste to form the first wiring. Subsequently part of the first wiring is coated at the crossing point with an insulating paste and baking the insulating paste to form a first insulating layer. The coating thickness of the insulating layer formed adjacent to sidewalls of the crossing point is substanially equal to the height of the first wiring.

Abstract: A substrate includes fine lines. The fine lines are obtained according to a fine-line forming process, which includes a process of projecting light from above the substrate onto predetermined regions on a photosensitive material provided on the substrate and a developing process after the light projection process. A narrow-width portion is provided at an end portion of each of the fine lines in a longitudinal direction of the fine line. The width of the narrow-width portion is smaller than the width of a portion adjacent to the narrow-width portion.

Abstract: In a method of manufacturing an electroconductive film, a developing process is implemented on a photosensitive paste layer (12) having a height of about 13 &mgr;m in a state where exposure is repeated twice in FIG. 1D, and thereafter, a baking process is completed to form a wiring pattern (20). As a result, the curling of an edge formed in the wiring pattern (20) can be remarkably reduced.