Patents by Inventor Yoshimichi Shiki

Yoshimichi Shiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE TREATMENT METHOD
    Publication number: 20120077348
    Abstract: There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.
    Type: Application
    Filed: December 6, 2011
    Publication date: March 29, 2012
    Applicant: Sony Corporation
    Inventors: Yoshimichi Shiki, Seiji Oda, Hayato Iwamoto, Yoshiya Hagimoto
  • Substrate treatment method
    Patent number: 8088693
    Abstract: There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: January 3, 2012
    Assignee: Sony Corporation
    Inventors: Yoshimichi Shiki, Seiji Oda, Hayato Iwamoto, Yoshiya Hagimoto
  • Substrate treatment method
    Publication number: 20070105242
    Abstract: There is provided a substrate treatment method for performing treatment by feeding a chemical liquid to a surface of a substrate, in which, before feeding the chemical liquid to a predetermined area of the substrate, a liquid substance having a resistivity lower than that of the chemical liquid is fed to the surface of the substrate so that the liquid substance wets at least the predetermined area, and then, the chemical liquid is fed to the predetermined area so that the treatment is performed on the substrate with the chemical liquid fed to the surface of the substrate.
    Type: Application
    Filed: October 4, 2006
    Publication date: May 10, 2007
    Applicant: Sony Corporation
    Inventors: Yoshimichi Shiki, Seiji Oda, Hayato Iwamoto, Yoshiya Hagimoto