Patents by Inventor Yoshimitsu Kumagai

Yoshimitsu Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6113053
    Abstract: An electronic chip component for measurement formed by bending a plate material into a structure having an end face substantially in the shape of a square C comprises a cross-link section at the top portion thereof, leg sections formed individually on the opposite sides of the cross-link section, and foot sections formed by individually bending the respective lower end portions of the leg sections inward and each having a bent proximal end and a bent distal end, the respective distal ends of the foot sections facing each other across a space, and an the respective undersurfaces of the foot sections individually constituting joint surfaces to be bonded to the terminal surface, at least the lower parts of the respective outer surfaces of the leg sections and the respective outer surfaces of the foot sections being subjected to surface treatment for soldering.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: September 5, 2000
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventors: Yoshimitsu Kumagai, Fumihiko Hikita
  • Patent number: 6024586
    Abstract: A ground terminal, which is mounted to a printed board, includes a terminal body formed with a screw insertion hole, and a plurality of leads formed integrally with a lower end of the terminal body, these leads being connected to a printed board ground. The ground terminal is fastened at its terminal body, which is bent along the printed board, to a chassis ground of an electronic device by means of a screw which extends through the screw insertion hole. Thus, the printed board is electrically connected to the chassis through the ground terminal, and is hence grounded. The ground terminal is formed with a plurality of projections around the screw insertion hole. These projections are brought in urged contact with the chassis ground, to thereby prevent the ground terminal from being deformed while the ground terminal is fastened to the chassis.
    Type: Grant
    Filed: September 2, 1994
    Date of Patent: February 15, 2000
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventor: Yoshimitsu Kumagai
  • Patent number: 5984692
    Abstract: A board stacking connector chip, which is interposed between opposed first and second printed boards, for stacking both the printed boards, comprises an upper joint portion joined to a connection terminal of the first printed board, a pair of side portions which extend downward from terminal portions of the upper joint portion and are opposed to each other, and a pair of lower joint portions which extend by being bent inward transversely from the lower ends of side portions, being opposed to each other, and are joined to a connection terminal of the second printed board, the upper joint portion, paired side portions, and paired lower joint portions being formed into a substantially rectangular shape in section by bending a plate.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: November 16, 1999
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventors: Yoshimitsu Kumagai, Ryoji Tanaka