Abstract: An embodiment of the present invention is an RFID label having a label substrate, an RFID antenna, an IC chip, and an adhesive layer that are stacked in this order. The label substrate is a thermal paper having a thermosensitive color developing layer on one surface. The RFID antenna is provided on the other surface of the label substrate. The IC chip is connected to the RFID antenna with an ultraviolet curable anisotropic conductive adhesive.

Abstract: The present invention is an IC chip mounting apparatus including: an ejection unit configured to eject an adhesive toward a reference position of each antenna of an antenna continuous body, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; a nozzle movable between a first position and a second position, the nozzle being configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of each antenna, when located at the second position; a determination unit configured to determine whether an IC chip is sucked by the nozzle while the nozzle is moved from the first position to the second position; and a moving machine configured to move the nozzle away from the second position when it is determined by the determination unit that an IC chip is not sucked by the nozzle.

Abstract: The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an ejection unit configured to eject a thermosetting adhesive toward a reference position of each antenna in the antenna continuous body; an IC chip placement unit configured to place an IC chip on the adhesive that is located on the reference position of each antenna in the antenna continuous body; a first light irradiator configured to irradiate the adhesive of each antenna with a first light, in the vicinity of a position where an IC chip is located on the conveying surface; and a second light irradiator configured to irradiate the adhesive of each antenna with a second light, at a position downstream from a position where the adhesive is irradiated with the first light.

Abstract: The present invention is an IC chip mounting apparatus including: a plurality of nozzles, each movable between a first position and a second position, each configured to suck an IC chip, when located at the first position, and to place the IC chip on the adhesive at the reference position of the corresponding antenna of an antenna continuous body, when located at the second position; a nozzle attachment to which the plurality of nozzles is attached; and a controller configured to control an angular velocity in rotating the nozzle attachment, so that a first nozzle of the plurality of nozzles that reaches the second position later than a non-sucking nozzle, places an IC chip on an antenna corresponding to the non-sucking nozzle, the non-sucking nozzle being a nozzle of the plurality of nozzles that has been determined as not sucking an IC chip.

Abstract: The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.

Abstract: An embodiment of the present invention is an IC chip mounting apparatus includes: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material, the antenna continuous body having an adhesive and an IC chip placed at a reference position of each of the antennas; a measurement unit configured to measure an interval between adjacent two of the antennas of the antenna continuous body; a press unit moving machine configured to sequentially feed out press units each having a pressing surface, from a waiting position, to move each of the press units along the conveying surface; and a controller configured to control timing of feeding out each of the press units from the waiting position based on the interval measured by the measurement unit, so that the pressing surface of each of the press units presses a predetermined region containing the reference position of each of the ant

Abstract: The present invention is an IC chip mounting apparatus for mounting an IC chip at a reference position of an inlay antenna while conveying the antenna, the IC chip mounting apparatus including: a nozzle configured to suck an IC chip when located at a first position and to place the IC chip at the reference position of the antenna when located at a second position; a nozzle attachment to which the nozzle is attached; an image acquisition unit configured to acquire an image of the IC chip sucked by the nozzle; and a correction amount determination unit configured to determine correction amounts for the IC chip sucked by the nozzle, based on the image acquired by the image acquisition unit. The correction amounts includes a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction of the antenna, and a third correction amount for correcting the position of the antenna in a width direction.

Abstract: An antenna pattern used in a UHF frequency band RFID inlay is provided with a substance; a dipole antenna formed from a metal foil upon the front surface of the substance; and a sub-element formed from a metal foil upon the back surface of the substance, wherein the dipole antenna is provided with a loop portion having a IC chip connecting portion; a pair of meanders configured to respectively extend from the loop portion so as to be line symmetrical; and capacitance hats, the sub-element has a pair of U-shapes, and a part of the sub-element overlaps with the dipole antenna through the substance.

Abstract: The manufacturing method of the antenna pattern has: a step of forming a dipole antenna on a front surface of a continuous substrate while conveying the continuous substrate; and a step of forming a sub-element on a back surface of the continuous substrate.

Abstract: A method for manufacturing antenna pattern according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of the antenna pattern arranged on a continuous body while conveying the continuous body of a base material.

Abstract: The manufacturing method of the antenna pattern has: a step of forming a dipole antenna on a front surface of a continuous substrate while conveying the continuous substrate; and a step of forming a sub-element on a back surface of the continuous substrate.

Abstract: An antenna pattern used in a UHF frequency band RFID inlay is provided with a substance; a dipole antenna formed from a metal foil upon the front surface of the substance; and a sub-element formed from a metal foil upon the back surface of the substance, wherein the dipole antenna is provided with a loop portion having a IC chip connecting portion; a pair of meanders configured to respectively extend from the loop portion so as to be line symmetrical; and capacitance hats, the sub-element has a pair of U-shapes, and a part of the sub-element overlaps with the dipole antenna through the substance.

Abstract: A method for manufacturing antenna pattern according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of the antenna pattern arranged on a continuous body while conveying the continuous body of a base material.

Abstract: A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement material buried in a surface layer of the upper or the lower side, or (iii) a sheet-shaped reinforcement material buried in a surface layer of the upper side or the lower side of the sheet, and a thin film reinforcement layer hardened into rubber in this surface layer or in a surface layer on both sides of the sheet. The formed sheet of thermalconductive silicone gel has low compressibility, high strength, is easy to handle during the mounting process, and can be reused after its contact compression between a chip and a heat sink has been released.

Abstract: A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement material buried in a surface layer of the upper or the lower side, or (iii) a sheet-shaped reinforcement material buried in a surface layer of the upper side or the lower side of the sheet, and a thin film reinforcement layer hardened into rubber in this surface layer or in a surface layer on both sides of the sheet. The formed sheet of thermalconductive silicone gel has low compressibility, high strength, is easy to handle during the mounting process, and can be reused after its contact compression between a chip and a heat sink has been released.

Abstract: A formed sheet of thermalconductive silicone gel is provided. The formed sheet has (i) a thin film reinforcement layer hardened into rubber only in a surface layer on the upper side, the lower side, or both sides, (ii) a sheet-shaped reinforcement material buried in a surface layer of the upper or the lower side, or (iii) a sheet-shaped reinforcement material buried in a surface layer of the upper side or the lower side of the sheet, and a thin film reinforcement layer hardened into rubber in this surface layer or in a surface layer on both sides of the sheet. The formed sheet of thermalconductive silicone gel has low compressibility, high strength, is easy to handle during the mounting process, and can be reused after its contact compression between a chip and a heat sink has been released.